264-5205-01 3M Electronic Solutions Division
Hersteller: 3M Electronic Solutions DivisionIC & Component Sockets Textool QFN .5MM,64P EVEN ROW,W/THRML PI
auf Bestellung 18 Stücke:
Lieferzeit 118-132 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 358.25 EUR |
| 10+ | 328.72 EUR |
| 25+ | 316.08 EUR |
| 50+ | 305.53 EUR |
Produktrezensionen
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Technische Details 264-5205-01 3M Electronic Solutions Division
Description: CONN SOCKET QFN 64POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: QFN, Number of Positions or Pins (Grid): 64 (4 x 16), Termination: Solder, Housing Material: Polyethersulfone (PES), Pitch - Mating: 0.020" (0.50mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.020" (0.50mm), Contact Finish - Post: Gold, Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 264-5205-01
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| 264-5205-01 | Hersteller : 3M Interconnect Solutions |
Conn QFN Socket SKT 64 POS Solder ST Thru-Hole Box |
Produkt ist nicht verfügbar |
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| 264-5205-01 | Hersteller : 3M Interconnect Solutions |
Conn QFN Socket SKT 64 POS Solder ST Thru-Hole Box |
Produkt ist nicht verfügbar |
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 |
264-5205-01 | Hersteller : 3M |
Description: CONN SOCKET QFN 64POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: QFN Number of Positions or Pins (Grid): 64 (4 x 16) Termination: Solder Housing Material: Polyethersulfone (PES) Pitch - Mating: 0.020" (0.50mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.020" (0.50mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |