268-5401-11-1102JH 3M
Hersteller: 3M
Description: CONN SOCKET CLCC 68POS GOLD
Part Status: Obsolete
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 68 (4 x 17)
Operating Temperature: -55°C ~ 105°C
Type: CLCC
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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Technische Details 268-5401-11-1102JH 3M
Description: CONN SOCKET CLCC 68POS GOLD, Part Status: Obsolete, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 68 (4 x 17), Operating Temperature: -55°C ~ 105°C, Type: CLCC, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote 268-5401-11-1102JH
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
 |
268-5401-11-1102JH | 3M Electronic Solutions Division |
IC & Component Sockets END USE-LCC 24.13+/-0.25 A BASE |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 268-5401-11-1102JH |
|
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets END USE-LCC 24.13+/-0.25 A BASE
IC & Component Sockets END USE-LCC 24.13+/-0.25 A BASE
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH