268-5401-50-1102 JH 3M Interconnect Solutions
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Technische Details 268-5401-50-1102 JH 3M Interconnect Solutions
Description: CONN SOCKET CLCC 68POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: CLCC, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 68 (4 x 17), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Obsolete.
Weitere Produktangebote 268-5401-50-1102 JH
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| 268-5401-50-1102 JH | Hersteller : 3M Interconnect Solutions |
 Conn LCC Socket SKT 68 POS 2.54mm Solder ST Thru-Hole |
Produkt ist nicht verfügbar |
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268-5401-50-1102JH | Hersteller : 3M |
Description: CONN SOCKET CLCC 68POS GOLD Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: CLCC Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 68 (4 x 17) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Obsolete |
Produkt ist nicht verfügbar |