28-3574-11 Aries Electronics
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 44.55 EUR |
| 11+ | 39 EUR |
| 22+ | 37.31 EUR |
| 55+ | 36.13 EUR |
| 110+ | 34.92 EUR |
| 253+ | 32.98 EUR |
| 506+ | 32.03 EUR |
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Technische Details 28-3574-11 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 28-3574-11
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| 28-3574-11 | Hersteller : Aries Electronics |
 Description: CONN IC DIP SOCKET ZIF 28POS GLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
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