| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.49 EUR |
| 10+ | 18.39 EUR |
| 30+ | 17.39 EUR |
| 60+ | 16.73 EUR |
| 105+ | 16.09 EUR |
| 255+ | 15.1 EUR |
| 510+ | 14.36 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 28-526-10 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 28-526-10 nach Preis ab 18.72 EUR bis 45.18 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
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28-526-10 | Aries Electronics |
 Description: CONN IC DIP SOCKET ZIF 28POS TINPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP) Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
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28-526-10 | ARIES |
Description: ARIES - 28-526-10 - IC- & Baustein-Sockel, 28 Kontakt(e), DIP, 2.54 mm, 526, 15.24 mm, Berylliumkupfer tariffCode: 85366930 productTraceability: No Kontaktüberzug: Verzinnte Kontakte rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 28Kontakt(e) Steckverbinder: DIP euEccn: NLR Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 15.24mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: 526 |
auf Bestellung 55 Stücke: Lieferzeit 14-21 Tag (e) |
|
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| 28-526-10 | Aries Electronics |
Conn ZIF Socket SKT 28 POS 2.54mm Solder ST Thru-Hole |
auf Bestellung 30 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 28-526-10 |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 23.79 EUR |
| 15+ | 19.65 EUR |
| 30+ | 18.72 EUR |
| 28-526-10 |
|
Hersteller: ARIES
Description: ARIES - 28-526-10 - IC- & Baustein-Sockel, 28 Kontakt(e), DIP, 2.54 mm, 526, 15.24 mm, Berylliumkupfer
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Verzinnte Kontakte
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 28Kontakt(e)
Steckverbinder: DIP
euEccn: NLR
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: 15.24mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: 526
Description: ARIES - 28-526-10 - IC- & Baustein-Sockel, 28 Kontakt(e), DIP, 2.54 mm, 526, 15.24 mm, Berylliumkupfer
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Verzinnte Kontakte
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 28Kontakt(e)
Steckverbinder: DIP
euEccn: NLR
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: 15.24mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: 526
auf Bestellung 55 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 45.18 EUR |
| 10+ | 31.19 EUR |
| 25+ | 23.88 EUR |
| 28-526-10 |
|
Hersteller: Aries Electronics
Conn ZIF Socket SKT 28 POS 2.54mm Solder ST Thru-Hole
Conn ZIF Socket SKT 28 POS 2.54mm Solder ST Thru-Hole
auf Bestellung 30 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 15+ | 23.32 EUR |