Produkte > ARIES ELECTRONICS > 28-6552-10*

28-6552-10* Aries Electronics

10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
IC & Component Sockets
auf Bestellung 41 Stücke:
Lieferzeit 10-14 Tag (e)
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1+30.32 EUR
9+26.29 EUR
27+24.92 EUR
54+24.55 EUR
108+21.68 EUR
252+20.22 EUR
504+19.78 EUR
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Technische Details 28-6552-10* Aries Electronics

Description: CONN IC DIP SOCKET ZIF 28POS TIN, Packaging: Bulk, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 28 (2 x 14), Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame.

Weitere Produktangebote 28-6552-10*

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Preis
28-6552-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Produkt ist nicht verfügbar
 Mindestbestellmenge: 45 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
28-6552-10 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Produkt ist nicht verfügbar
Mindestbestellmenge: 45 Stücke
Im Einkaufswagen  Stück im Wert von  UAH