auf Bestellung 7 Stücke:
Lieferzeit 14-28 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 38.69 EUR |
9+ | 32.63 EUR |
27+ | 30.08 EUR |
108+ | 30.06 EUR |
252+ | 30.03 EUR |
504+ | 29.77 EUR |
1008+ | 29.48 EUR |
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Technische Details 28-6553-10* Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Material - Post: Beryllium Copper.
Weitere Produktangebote 28-6553-10*
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
28-6553-10 | Hersteller : Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS GLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper |
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