| Anzahl | Preis |
|---|---|
| 1+ | 26.4 EUR |
| 9+ | 20.47 EUR |
| 27+ | 19.61 EUR |
| 54+ | 19.25 EUR |
| 108+ | 18.11 EUR |
| 252+ | 17.46 EUR |
| 504+ | 17.21 EUR |
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Technische Details 28-6553-10* Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD, Contact Material - Post: Beryllium Copper, Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 28 (2 x 14), Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote 28-6553-10*
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
| 28-6553-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS GLDContact Material - Post: Beryllium Copper Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 45 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 28-6553-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 45 Stücke
Im Einkaufswagen
Stück im Wert von UAH

