28-6554-10 Aries Electronics
Hersteller: Aries ElectronicsDescription: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 172 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 22.42 EUR |
| 18+ | 18.29 EUR |
| 27+ | 17.77 EUR |
| 54+ | 16.92 EUR |
| 108+ | 16.11 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 28-6554-10 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 28-6554-10 nach Preis ab 15.01 EUR bis 23.02 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
28-6554-10 | Hersteller : Aries Electronics |
IC & Component Sockets 28P TEST SOCKET TIN |
auf Bestellung 115 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
28-6554-10 | Hersteller : ARIES |
Description: ARIES - 28-6554-10 - IC- & Baustein-Sockel, 28 Kontakt(e), DIP, 2.54 mm, X55X, 15.24 mm, Berylliumkupfer tariffCode: 85366930 productTraceability: No Kontaktüberzug: Verzinnte Kontakte rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 28Kontakt(e) Steckverbinder: DIP euEccn: NLR Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 15.24mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: X55X |
auf Bestellung 24 Stücke: Lieferzeit 14-21 Tag (e) |