28-6554-10 Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 27.39 EUR |
| 9+ | 23.73 EUR |
| 27+ | 22.51 EUR |
| 54+ | 22.18 EUR |
| 108+ | 19.59 EUR |
| 252+ | 18.27 EUR |
| 504+ | 17.86 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 28-6554-10 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN, Packaging: Tube, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 28-6554-10 nach Preis ab 22.78 EUR bis 51.53 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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28-6554-10 | Aries Electronics |
 Description: CONN IC DIP SOCKET ZIF 28POS TINPackaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 201 Stücke: Lieferzeit 10-14 Tag (e) |
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28-6554-10 | ARIES |
Description: ARIES - 28-6554-10 - IC- & Baustein-Sockel, 28 Kontakt(e), DIP, 2.54 mm, X55X, 15.24 mm, Berylliumkupfer tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Berylliumkupfer isCanonical: Y Anzahl der Kontakte: 28Kontakt(e) Reihenabstand: 15.24mm Steckverbinder: DIP Produktpalette: X55X productTraceability: No usEccn: EAR99 Rastermaß: 2.54mm |
auf Bestellung 40 Stücke: Lieferzeit 14-21 Tag (e) |
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| 28-6554-10 |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 201 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 31.71 EUR |
| 18+ | 25.85 EUR |
| 27+ | 25.12 EUR |
| 54+ | 23.92 EUR |
| 108+ | 22.78 EUR |
| 28-6554-10 |
|
Hersteller: ARIES
Description: ARIES - 28-6554-10 - IC- & Baustein-Sockel, 28 Kontakt(e), DIP, 2.54 mm, X55X, 15.24 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 28Kontakt(e)
Reihenabstand: 15.24mm
Steckverbinder: DIP
Produktpalette: X55X
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
Description: ARIES - 28-6554-10 - IC- & Baustein-Sockel, 28 Kontakt(e), DIP, 2.54 mm, X55X, 15.24 mm, Berylliumkupfer
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 28Kontakt(e)
Reihenabstand: 15.24mm
Steckverbinder: DIP
Produktpalette: X55X
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 40 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 51.53 EUR |
| 10+ | 38.06 EUR |
| 25+ | 32.88 EUR |