Hersteller: Phoenix Contact
Description: SOLENOID DRIVER 0.05A 12.9V LOAD
Packaging: Bulk
For Use With/Related Products: EX-I Series
Mounting Type: DIN Rail
Current - Output: 0.05A
Type: Module
Operating Temperature: -20°C ~ 55°C
Voltage - Supply: Loop Power
Voltage - Load: 12.9V
Number of Motors: 1
Motor Type: Solenoid
Control / Drive Type: Solenoid
Wattage - Load: 1.4 W

Hersteller: Texas Instruments
Description: IC DECODER/DEMUX 1X2:4 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Discontinued at Digi-Key

Hersteller: Texas Instruments
Description: IC DECODER/DEMUX 1X2:4 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Discontinued at Digi-Key

Hersteller: Texas Instruments
Description: IC DECODER/DEMUX 1X2:4 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Discontinued at Digi-Key

Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Part Status: Active

Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active

Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active

Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active

Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Part Status: Active

Hersteller: TE Application Tooling
Description: FA HD-I 5SMPO130F LEADMAKER
Packaging: Bulk
For Use With/Related Products: Rectangular Connectors
Tool Type: Applicator - HDI for Bench Press
Wire Gauge or Range - mm²: 1.50 ~ 2.50mm²
Tool Method: Automated
Tool Type Feature: Terminator
Ratcheting: No Ratchet
Wire Entry Location: Side Entry

Hersteller: Würth Elektronik
Description: CAP ALUM 0.33UF 20% 50V RADIAL
Packaging: Tape & Box (TB)
Tolerance: ±20%
Package / Case: Radial, Can
Size / Dimension: 0.197" Dia (5.00mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C
Applications: General Purpose
Lead Spacing: 0.079" (2.00mm)
Lifetime @ Temp.: 2000 Hrs @ 85°C
Height - Seated (Max): 0.492" (12.50mm)
Part Status: Obsolete
Capacitance: 0.33 µF
Voltage - Rated: 50 V
Ripple Current @ Low Frequency: 5.5 mA @ 120 Hz
Ripple Current @ High Frequency: 9.35 mA @ 100 kHz

Hersteller: NXP Semiconductors
High Performance Digital Signal Processor

Hersteller: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Clock Rate: 400MHz
Supplier Device Package: 144-HLQFP (20x20)

Hersteller: NXP Semiconductors
Smart Card Interface 20MHz 3.3V/5V 665mW Tray 64-Pin TFBGA