290-1294-00-3302J 3M Electronic Solutions Division
Hersteller: 3M Electronic Solutions DivisionIC & Component Sockets 0.070" DIP SOCKET 90 Contact Qty.
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 101.78 EUR |
| 10+ | 75.42 EUR |
| 30+ | 75.38 EUR |
| 50+ | 74.17 EUR |
| 100+ | 73.96 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 290-1294-00-3302J 3M Electronic Solutions Division
Description: CONN IC DIP SOCKET ZIF 90POS GLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 90 (2 x 45), Termination: Solder, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.070" (1.78mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 290-1294-00-3302J
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
|
290-1294-00-3302J | Hersteller : 3M |
Conn DIP Socket SKT 90 POS 1.78mm Solder ST Thru-Hole Box |
Produkt ist nicht verfügbar |
|
|
|
290-1294-00-3302J | Hersteller : 3M Interconnect Solutions |
Conn DIP Socket SKT 90 POS 1.78mm Solder ST Thru-Hole Box |
Produkt ist nicht verfügbar |
|
| 290-1294-00-3302J | Hersteller : 3M Interconnect Solutions |
Conn DIP Socket SKT 90 POS 1.78mm Solder ST Thru-Hole Box |
Produkt ist nicht verfügbar |
||
|
|
290-1294-00-3302J | Hersteller : 3M |
Description: CONN IC DIP SOCKET ZIF 90POS GLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP) Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 90 (2 x 45) Termination: Solder Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
