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290-1294-00-3302J

290-1294-00-3302J 3M Electronic Solutions Division

3mtm-textooltm-shrink-zi-dip-test-and-burn-in-socket-ts0366.pdf Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.070" DIP SOCKET 90 Contact Qty.
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+105.6 EUR
10+ 96.92 EUR
20+ 93.17 EUR
50+ 90.08 EUR
100+ 85.1 EUR
200+ 82.63 EUR
500+ 80.77 EUR
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Produktbewertung abgeben

Technische Details 290-1294-00-3302J 3M Electronic Solutions Division

Description: CONN IC DIP SOCKET ZIF 90POS GLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 90 (2 x 45), Termination: Solder, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.070" (1.78mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.

Weitere Produktangebote 290-1294-00-3302J

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290-1294-00-3302J 290-1294-00-3302J Hersteller : 3M ts0366.pdf.pdf Conn DIP Socket SKT 90 POS 1.78mm Solder ST Thru-Hole Box
Produkt ist nicht verfügbar
290-1294-00-3302J 290-1294-00-3302J Hersteller : 3M Interconnect Solutions ts0366.pdf.pdf Conn DIP Socket SKT 90 POS 1.78mm Solder ST Thru-Hole Box
Produkt ist nicht verfügbar
290-1294-00-3302J Hersteller : 3M Interconnect Solutions ts0366.pdf.pdf Conn DIP Socket SKT 90 POS 1.78mm Solder ST Thru-Hole Box
Produkt ist nicht verfügbar
290-1294-00-3302J 290-1294-00-3302J Hersteller : 3M 3mtm-textooltm-shrink-zi-dip-test-and-burn-in-socket-ts0366.pdf Description: CONN IC DIP SOCKET ZIF 90POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 90 (2 x 45)
Termination: Solder
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar