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Technische Details 290-1294-00-3302J 3M
Description: CONN IC DIP SOCKET ZIF 90POS GLD, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.070" (1.78mm), Contact Material - Mating: Beryllium Copper, Housing Material: Polysulfone (PSU), Glass Filled, Termination: Solder, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.070" (1.78mm), Number of Positions or Pins (Grid): 90 (2 x 45), Operating Temperature: -55°C ~ 125°C, Type: DIP, ZIF (ZIP).
Weitere Produktangebote 290-1294-00-3302J nach Preis ab 101.74 EUR bis 130 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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290-1294-00-3302J | 3M Electronic Solutions Division |
 IC & Component Sockets 0.070" DIP SOCKET 90 Contact Qty. |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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| 290-1294-00-3302J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.070" DIP SOCKET 90 Contact Qty.
IC & Component Sockets 0.070" DIP SOCKET 90 Contact Qty.
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 130 EUR |
| 10+ | 113.04 EUR |
| 20+ | 107.48 EUR |
| 50+ | 105.05 EUR |
| 100+ | 101.74 EUR |