auf Bestellung 354 Stücke:
Lieferzeit 14-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 24.13 EUR |
| 10+ | 21.71 EUR |
| 22+ | 19.92 EUR |
| 110+ | 19.4 EUR |
| 264+ | 17.29 EUR |
| 506+ | 17.11 EUR |
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Technische Details 299-43-618-10-002000 Mill-Max
Description: CONN IC DIP SOCKET 18POS GOLD, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Right Angle, Horizontal, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 18 (2 x 9), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Weitere Produktangebote 299-43-618-10-002000 nach Preis ab 21.22 EUR bis 25.04 EUR
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299-43-618-10-002000 | Hersteller : Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 18POS GOLDFeatures: Closed Frame Packaging: Tube Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
auf Bestellung 36 Stücke: Lieferzeit 21-28 Tag (e) |
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