| Anzahl | Privatkunde |
|---|---|
| 1+ | 18.41 EUR |
| 10+ | 17.5 EUR |
| 23+ | 14.88 EUR |
| 115+ | 11.5 EUR |
| 506+ | 11.47 EUR |
| 1012+ | 11.41 EUR |
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Technische Details 299-87-618-10-002101 Preci-dip
Description: CONN IC DIP SOCKET 18POS GOLD, Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: FLASH, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 18 (2 x 9), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Right Angle, Horizontal, Features: Closed Frame, Packaging: Tube, Contact Material - Post: Brass, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm).
Weitere Produktangebote 299-87-618-10-002101
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
299-87-618-10-002101 | Preci-Dip |
 Description: CONN IC DIP SOCKET 18POS GOLDContact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 18 (2 x 9) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Packaging: Tube Contact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 644 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 299-87-618-10-002101 |
|
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Packaging: Tube
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Description: CONN IC DIP SOCKET 18POS GOLD
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Packaging: Tube
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Produkt ist nicht verfügbar
Mindestbestellmenge: 644 Stücke
Im Einkaufswagen
Stück im Wert von UAH