32-6554-10 Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 40.17 EUR |
| 8+ | 33.62 EUR |
| 24+ | 31.73 EUR |
| 56+ | 30.34 EUR |
| 104+ | 28.96 EUR |
| 256+ | 25.68 EUR |
| 504+ | 24.88 EUR |
Artikel auf Bestellung
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Lieferzeit:
10-14 Tag (e)
Produktrezensionen
Produktbewertung abgeben
Technische Details 32-6554-10 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 32-6554-10 nach Preis ab 28.66 EUR bis 66.79 EUR
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32-6554-10 | Aries Electronics |
 Description: CONN IC DIP SOCKET ZIF 32POS TINFeatures: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 308 Stücke: Lieferzeit 10-14 Tag (e) |
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32-6554-10 | ARIES |
Description: ARIES - 32-6554-10 - IC- & Baustein-Sockel, 32 Kontakt(e), DIP-Sockel, 2.54 mm, X55X, 15.24 mm, Berylliumkupfer tariffCode: 85366990 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Berylliumkupfer isCanonical: Y Anzahl der Kontakte: 32Kontakt(e) Reihenabstand: 15.24mm Steckverbinder: DIP-Sockel Produktpalette: X55X productTraceability: No usEccn: EAR99 Rastermaß: 2.54mm |
auf Bestellung 7 Stücke: Lieferzeit 14-21 Tag (e) |
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| 32-6554-10 |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 308 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 42.39 EUR |
| 16+ | 34.84 EUR |
| 32+ | 33.18 EUR |
| 56+ | 31.89 EUR |
| 104+ | 30.54 EUR |
| 256+ | 28.66 EUR |
| 32-6554-10 |
|
Hersteller: ARIES
Description: ARIES - 32-6554-10 - IC- & Baustein-Sockel, 32 Kontakt(e), DIP-Sockel, 2.54 mm, X55X, 15.24 mm, Berylliumkupfer
tariffCode: 85366990
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 32Kontakt(e)
Reihenabstand: 15.24mm
Steckverbinder: DIP-Sockel
Produktpalette: X55X
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
Description: ARIES - 32-6554-10 - IC- & Baustein-Sockel, 32 Kontakt(e), DIP-Sockel, 2.54 mm, X55X, 15.24 mm, Berylliumkupfer
tariffCode: 85366990
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Berylliumkupfer
isCanonical: Y
Anzahl der Kontakte: 32Kontakt(e)
Reihenabstand: 15.24mm
Steckverbinder: DIP-Sockel
Produktpalette: X55X
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 7 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 66.79 EUR |