Produkte > ARIES ELECTRONICS > 32-6570-10

32-6570-10 Aries Electronics

Name: 32-6570-10
Brand: Aries Electronics
SKU: 793059-4
Price: 31.84 EUR
Availability: InStock

10019_universal_zif_test_and_burn_in_socket.pdf

Hersteller: Aries Electronics
IC & Component Sockets QUICK RELEASE 32 PIN TIN

auf Bestellung 31 Stücke:

Lieferzeit 10-14 Tag (e)

Anzahl	Privatkunde
1+	37.89 EUR
8+	32.19 EUR
56+	29.74 EUR
104+	27.44 EUR
256+	27.2 EUR
504+	27.06 EUR

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Technische Details 32-6570-10 Aries Electronics

Description: CONN IC DIP SOCKET ZIF 32POS TIN, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 32 (2 x 16), Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.

Weitere Produktangebote 32-6570-10

Foto	Bezeichnung	Hersteller	Beschreibung	Verfügbarkeit	Privatkunde
	32-6570-10	Aries Electronics	Description: CONN IC DIP SOCKET ZIF 32POS TIN Part Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 32 (2 x 16) Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk	Produkt ist nicht verfügbar Benachrichtigung bei Verfügbarkeit	Mindestbestellmenge: 32 Stücke Im Einkaufswagen Stück im Wert von UAH

32-6570-10

Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk

Produkt ist nicht verfügbar

Mindestbestellmenge: 32 Stücke

Im Einkaufswagen Stück im Wert von UAH