Produkte > ARIES ELECTRONICS > 32-6572-11

32-6572-11 Aries Electronics

Name: 32-6572-11
Brand: Aries Electronics
SKU: 794697-4
Price: 63.29 EUR
Availability: InStock

10019_universal_zif_test_and_burn_in_socket.pdf

Hersteller: Aries Electronics
IC & Component Sockets QUICK RELEASE 32 PIN GOLD

auf Bestellung 16 Stücke:

Lieferzeit 10-14 Tag (e)

Anzahl	Privatkunde
1+	75.32 EUR
10+	64.01 EUR
20+	60.11 EUR
50+	58.1 EUR
100+	54.51 EUR
200+	52.94 EUR

Im Einkaufswagen Stück im Wert von UAH

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Technische Details 32-6572-11 Aries Electronics

Description: CONN IC DIP SOCKET ZIF 32POS TIN, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 32 (2 x 16), Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.

Weitere Produktangebote 32-6572-11

Foto	Bezeichnung	Hersteller	Beschreibung	Verfügbarkeit	Privatkunde
	32-6572-11	Aries Electronics	Description: CONN IC DIP SOCKET ZIF 32POS TIN Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 32 (2 x 16) Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk	Produkt ist nicht verfügbar Benachrichtigung bei Verfügbarkeit	Mindestbestellmenge: 20 Stücke Im Einkaufswagen Stück im Wert von UAH

32-6572-11

Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 32POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk

Produkt ist nicht verfügbar

Mindestbestellmenge: 20 Stücke

Im Einkaufswagen Stück im Wert von UAH