Technische Details 335824B00034G Boyd Corporation
Description: HEATSINK BGA W/ADHESIVE TAPE, Packaging: Bulk, Material: Aluminum, Length: 1.180" (29.97mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.180" (29.97mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 2.0W @ 60°C, Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM, Thermal Resistance @ Natural: 29.40°C/W, Fin Height: 0.370" (9.40mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 335824B00034G nach Preis ab 11.7 EUR bis 16.53 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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335824B00034G | Boyd Corporation |
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized |
auf Bestellung 1387 Stücke: Lieferzeit 14-21 Tag (e) |
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335824B00034G | Boyd Laconia, LLC |
Description: HEATSINK BGA W/ADHESIVE TAPEPackaging: Bulk Material: Aluminum Length: 1.180" (29.97mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.180" (29.97mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 2.0W @ 60°C Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM Thermal Resistance @ Natural: 29.40°C/W Fin Height: 0.370" (9.40mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 803 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 335824B00034G |
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Hersteller: Boyd Corporation
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized
auf Bestellung 1387 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 13+ | 13.78 EUR |
| 335824B00034G |
![]() |
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 803 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.53 EUR |
| 10+ | 14.63 EUR |
| 25+ | 13.93 EUR |
| 50+ | 13.44 EUR |
| 100+ | 12.95 EUR |
| 250+ | 12.33 EUR |
| 672+ | 11.7 EUR |



