335824B00034G Boyd Laconia, LLC
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1267 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 14.61 EUR |
10+ | 14.22 EUR |
672+ | 10.27 EUR |
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Technische Details 335824B00034G Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE, Packaging: Bulk, Material: Aluminum, Length: 1.180" (29.97mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.180" (29.97mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 2.0W @ 60°C, Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM, Thermal Resistance @ Natural: 29.40°C/W, Fin Height: 0.370" (9.40mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 335824B00034G
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
335824B00034G | Hersteller : Aavid | Heat Sinks Heat Sink for Plastic BGA Packages, Black, 30x30x9.4mm, IC Pkg=31 x 31, Tape #34 |
Produkt ist nicht verfügbar |