342948-copper skivfin Boyd Laconia, LLC
Hersteller: Boyd Laconia, LLC
Description: 342948,REV03(GP)
Packaging: Bulk
Material: Copper
Length: 2.717" (69.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 2.756" (70.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.551" (14.00mm)
Description: 342948,REV03(GP)
Packaging: Bulk
Material: Copper
Length: 2.717" (69.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 2.756" (70.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.551" (14.00mm)
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Technische Details 342948-copper skivfin Boyd Laconia, LLC
Description: 342948,REV03(GP), Packaging: Bulk, Material: Copper, Length: 2.717" (69.00mm), Shape: Rectangular, Fins, Type: Board Level, Width: 2.756" (70.00mm), Package Cooled: BGA, FPGA, Attachment Method: Push Pin, Thermal Material, Fin Height: 0.551" (14.00mm).
Weitere Produktangebote 342948-copper skivfin
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| 342948-copper skivfin | Hersteller : Aavid |
 Heat Sinks Square, Skived Fin Heat Sink for BGA/FPGA, 2.8mm Thickness, 14mm Height, 70mm Width, 69mm Length |
Produkt ist nicht verfügbar |