342949

342949 Boyd Laconia, LLC


Board-Level-Cooling-Square-Skived-Fin.pdf Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 80X80X12MM
Packaging: Tray
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.150" (80.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.10°C/W
Fin Height: 0.472" (12.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
auf Bestellung 177 Stücke:

Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1+146.54 EUR
10+ 137.91 EUR
25+ 129.29 EUR
50+ 120.67 EUR
100+ 116.36 EUR
Produktrezensionen
Produktbewertung abgeben

Technische Details 342949 Boyd Laconia, LLC

Description: COPPER HEATSINK 80X80X12MM, Packaging: Tray, Material: Copper, Length: 3.150" (80.00mm), Shape: Square, Fins, Type: Top Mount, Skived, Width: 3.150" (80.00mm), Package Cooled: BGA, Attachment Method: Push Pin, Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM, Thermal Resistance @ Natural: 5.10°C/W, Fin Height: 0.472" (12.00mm), Material Finish: AavSHIELD 3C, Part Status: Active.

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342949 Hersteller : BOYD CORP Board-Level-Cooling-Square-Skived-Fin.pdf Category: Heatsinks
Description: Heatsink: attachable; grilled; L: 80mm; W: 80mm; H: 12mm; copper
Height: 12mm
Material: copper
Type of heatsink: attachable
Length: 80mm
Width: 80mm
Heatsink shape: grilled
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
342949 Hersteller : Aavid Board_Level_Cooling_Square_Skived_Fin-3044617.pdf Heat Sinks Square, Skived Fin Heat Sink for BGA/FPGA, 2.3mm Thick, 12mm H, 80mm W, 80mm L
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342949 Hersteller : BOYD CORP Board-Level-Cooling-Square-Skived-Fin.pdf Category: Heatsinks
Description: Heatsink: attachable; grilled; L: 80mm; W: 80mm; H: 12mm; copper
Height: 12mm
Material: copper
Type of heatsink: attachable
Length: 80mm
Width: 80mm
Heatsink shape: grilled
Produkt ist nicht verfügbar