374224B60023G Aavid
Hersteller: AavidHeat Sinks Heat Sink with BGA Solder Anchor, 23x23x25mm, Black, 2 Anchors, IC Pkg=23 x 23
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 5.28 EUR |
| 10+ | 5 EUR |
| 25+ | 4.89 EUR |
| 50+ | 4.7 EUR |
| 100+ | 4.49 EUR |
| 168+ | 4.28 EUR |
| 504+ | 4.17 EUR |
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Technische Details 374224B60023G Aavid
Description: HEATSINK BGA W/O SOLDER ANCHORS, Packaging: Bulk, Material: Aluminum, Length: 0.906" (23.01mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.906" (23.01mm), Package Cooled: BGA, Attachment Method: Solder Anchor, Power Dissipation @ Temperature Rise: 1.0W @ 20°C, Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 400 LFM, Thermal Resistance @ Natural: 19.70°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized.
Weitere Produktangebote 374224B60023G
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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374224B60023G | Hersteller : Aavid Thermalloy |
Heat Sink Passive BGA Pin Array Clip Aluminum Black Anodized |
auf Bestellung 168 Stücke: Lieferzeit 14-21 Tag (e) |
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374224B60023G | Hersteller : Boyd Laconia, LLC |
Description: HEATSINK BGA W/O SOLDER ANCHORS Packaging: Bulk Material: Aluminum Length: 0.906" (23.01mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.906" (23.01mm) Package Cooled: BGA Attachment Method: Solder Anchor Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 400 LFM Thermal Resistance @ Natural: 19.70°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
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| 374224B60023G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm Height: 25mm Width: 23mm Length: 23mm Material: aluminium Material finishing: anodized Application: BGA; FPGA Colour: black Type of heatsink: extruded Heatsink shape: grilled |
Produkt ist nicht verfügbar |