374324B00032G Boyd Corporation
Hersteller: Boyd CorporationHeat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 30.6°C/W Black Anodized
auf Bestellung 901 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 102+ | 1.55 EUR |
| 104+ | 1.46 EUR |
| 107+ | 1.36 EUR |
| 109+ | 1.29 EUR |
| 111+ | 1.21 EUR |
| 500+ | 1.14 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 374324B00032G Boyd Corporation
Description: 374324B00032G, Packaging: Bulk, Material: Aluminum, Length: 1.063" (27.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.063" (27.00mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 1.5W @ 40°C, Thermal Resistance @ Forced Air Flow: 9.35°C/W @ 200 LFM, Thermal Resistance @ Natural: 30.60°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized.
Weitere Produktangebote 374324B00032G nach Preis ab 1.09 EUR bis 5.3 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
374324B00032G | Hersteller : Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 30.6°C/W Black Anodized |
auf Bestellung 901 Stücke: Lieferzeit 14-21 Tag (e) |
|
||||||||||||||||
| 374324B00032G | Hersteller : Aavid |
Heat Sinks Heat Sink for Metal/Ceramic BGA Packages, Black, 27x27x10mm, IC=27x27, Tape #32 |
auf Bestellung 1628 Stücke: Lieferzeit 14-28 Tag (e) |
|
|||||||||||||||||
 |
374324B00032G | Hersteller : Aavid Thermalloy |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 30.6C/W Black Anodized |
Produkt ist nicht verfügbar |
|||||||||||||||||
| 374324B00032G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm Type of heatsink: extruded Heatsink shape: grilled Application: BGA; FPGA Colour: black Length: 27mm Width: 27mm Height: 10mm Material: aluminium Material finishing: anodized Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
||||||||||||||||||
| 374324B00032G | Hersteller : Aavid, Thermal Division of Boyd Corporation |
Description: 374324B00032G Packaging: Bulk Material: Aluminum Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.063" (27.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 1.5W @ 40°C Thermal Resistance @ Forced Air Flow: 9.35°C/W @ 200 LFM Thermal Resistance @ Natural: 30.60°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
||||||||||||||||||
| 374324B00032G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm Type of heatsink: extruded Heatsink shape: grilled Application: BGA; FPGA Colour: black Length: 27mm Width: 27mm Height: 10mm Material: aluminium Material finishing: anodized |
Produkt ist nicht verfügbar |