374524B60023G Aavid
Hersteller: AavidHeat Sinks Heat Sink with BGA Solder Anchor, 27x27x25mm, Black, 2 Anchors, IC Pkg=27 x 27
auf Bestellung 699 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 5.35 EUR |
| 216+ | 4.52 EUR |
| 1080+ | 4.42 EUR |
| 2592+ | 4.4 EUR |
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Technische Details 374524B60023G Aavid
Description: HEATSINK BGA W/O SOLDER ANCHORS, Packaging: Bulk, Material: Aluminum, Length: 1.063" (27.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.063" (27.00mm), Package Cooled: BGA, Attachment Method: Solder Anchor, Power Dissipation @ Temperature Rise: 1.0W @ 20°C, Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 16.50°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized.
Weitere Produktangebote 374524B60023G
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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374524B60023G | Hersteller : Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Anchor Aluminum Black Anodized |
Produkt ist nicht verfügbar |
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374524B60023G | Hersteller : Boyd Laconia, LLC |
Description: HEATSINK BGA W/O SOLDER ANCHORS Packaging: Bulk Material: Aluminum Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.063" (27.00mm) Package Cooled: BGA Attachment Method: Solder Anchor Power Dissipation @ Temperature Rise: 1.0W @ 20°C Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM Thermal Resistance @ Natural: 16.50°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |