374624B00032G Boyd Laconia, LLC
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA 35X35X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 7.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA 35X35X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 7.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 597 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
4+ | 8.37 EUR |
10+ | 8.16 EUR |
510+ | 6.4 EUR |
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Technische Details 374624B00032G Boyd Laconia, LLC
Description: HEATSINK BGA 35X35X10MM W/ADH, Packaging: Bulk, Material: Aluminum, Length: 1.378" (35.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.378" (35.00mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 1.5W @ 40°C, Thermal Resistance @ Forced Air Flow: 7.60°C/W @ 200 LFM, Thermal Resistance @ Natural: 23.40°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 374624B00032G nach Preis ab 5.75 EUR bis 8.42 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
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374624B00032G | Hersteller : Aavid | Heat Sinks Heat Sink for Metal/Ceramic BGA Packages, Black, 35x35x10mm, IC=35x35, Tape #32 |
auf Bestellung 710 Stücke: Lieferzeit 14-28 Tag (e) |
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374624B00032G | Hersteller : BOYD | Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4C/W Black Anodized |
Produkt ist nicht verfügbar |
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374624B00032G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm Application: BGA; FPGA Colour: black Material: aluminium Material finishing: anodized Type of heatsink: extruded Length: 35mm Width: 35mm Heatsink shape: grilled Height: 10mm Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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374624B00032G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm Application: BGA; FPGA Colour: black Material: aluminium Material finishing: anodized Type of heatsink: extruded Length: 35mm Width: 35mm Heatsink shape: grilled Height: 10mm |
Produkt ist nicht verfügbar |