Technische Details 374724B00032G Boyd Corporation
Description: HEATSINK BGA W/ADHESIVE TAPE, Packaging: Bulk, Material: Aluminum, Length: 1.378" (35.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.378" (35.00mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 3.0W @ 50°C, Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM, Thermal Resistance @ Natural: 15.30°C/W, Fin Height: 0.709" (18.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 374724B00032G nach Preis ab 4.81 EUR bis 7.06 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
374724B00032G | Boyd Corporation |
 Heat Sink Passive BGA Pin Array Aluminum 15.3°C/W Black Anodized |
auf Bestellung 385 Stücke: Lieferzeit 14-21 Tag (e) |
|
||||||||||||||||
 |
374724B00032G | Boyd Laconia, LLC |
Description: HEATSINK BGA W/ADHESIVE TAPE Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM Thermal Resistance @ Natural: 15.30°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1649 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 374724B00032G |
|
Hersteller: Boyd Corporation
Heat Sink Passive BGA Pin Array Aluminum 15.3°C/W Black Anodized
Heat Sink Passive BGA Pin Array Aluminum 15.3°C/W Black Anodized
auf Bestellung 385 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 33+ | 6.18 EUR |
| 374724B00032G |
|
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1649 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.06 EUR |
| 10+ | 6.25 EUR |
| 25+ | 5.95 EUR |
| 50+ | 5.74 EUR |
| 100+ | 5.52 EUR |
| 250+ | 5.26 EUR |
| 672+ | 5 EUR |
| 1344+ | 4.81 EUR |