374724B00035G Boyd Laconia, LLC
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA 35X35X18MM W/ADH
Attachment Method: Thermal Tape, Adhesive (Included)
Package Cooled: BGA
Width: 1.378" (35.00mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 1.378" (35.00mm)
Material: Aluminum
Packaging: Bulk
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.709" (18.00mm)
Thermal Resistance @ Natural: 15.30°C/W
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.69 EUR |
| 10+ | 6.81 EUR |
| 25+ | 6.49 EUR |
| 50+ | 6.25 EUR |
| 100+ | 6.02 EUR |
| 250+ | 5.74 EUR |
| 672+ | 5.44 EUR |
| 1344+ | 5.25 EUR |
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Technische Details 374724B00035G Boyd Laconia, LLC
Description: HEATSINK BGA 35X35X18MM W/ADH, Attachment Method: Thermal Tape, Adhesive (Included), Package Cooled: BGA, Width: 1.378" (35.00mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 1.378" (35.00mm), Material: Aluminum, Packaging: Bulk, Part Status: Active, Material Finish: Black Anodized, Fin Height: 0.709" (18.00mm), Thermal Resistance @ Natural: 15.30°C/W, Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 3.0W @ 50°C.
Weitere Produktangebote 374724B00035G nach Preis ab 6.12 EUR bis 11.58 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||
|---|---|---|---|---|---|---|---|---|---|
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374724B00035G | Aavid |
Heat Sinks Heat Sink for Plastic BGA Packages, Black, 35x35x18mm, IC Pkg=35 x 35, Tape #35 |
auf Bestellung 579 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 374724B00035G |
|
Hersteller: Aavid
Heat Sinks Heat Sink for Plastic BGA Packages, Black, 35x35x18mm, IC Pkg=35 x 35, Tape #35
Heat Sinks Heat Sink for Plastic BGA Packages, Black, 35x35x18mm, IC Pkg=35 x 35, Tape #35
auf Bestellung 579 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 11.58 EUR |
| 672+ | 6.12 EUR |