375024B00032G Aavid
Hersteller: Aavid
Heat Sinks Heat Sink for Metal/Ceramic BGA Packages, Black, 40x40x18mm, IC=40x40, Tape #32
Heat Sinks Heat Sink for Metal/Ceramic BGA Packages, Black, 40x40x18mm, IC=40x40, Tape #32
auf Bestellung 735 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 5.21 EUR |
10+ | 5.07 EUR |
25+ | 4.66 EUR |
100+ | 4.38 EUR |
250+ | 4.1 EUR |
450+ | 4.03 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 375024B00032G Aavid
Description: HEATSINK BGA W/ADHESIVE TAPE, Packaging: Bulk, Material: Aluminum, Length: 1.575" (40.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.575" (40.01mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 2.0W @ 30°C, Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM, Thermal Resistance @ Natural: 12.00°C/W, Fin Height: 0.709" (18.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 375024B00032G nach Preis ab 3.58 EUR bis 5.24 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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375024B00032G | Hersteller : Boyd Laconia, LLC |
Description: HEATSINK BGA W/ADHESIVE TAPE Packaging: Bulk Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.575" (40.01mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 2.0W @ 30°C Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM Thermal Resistance @ Natural: 12.00°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1360 Stücke: Lieferzeit 10-14 Tag (e) |
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375024B00032G Produktcode: 126372 |
Gehäuse, Halter, Montage- und Installationselemente > Radiatoren |
Produkt ist nicht verfügbar
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375024B00032G | Hersteller : Boyd Corporation | Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 12.2°C/W Black Anodized |
Produkt ist nicht verfügbar |
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375024B00032G | Hersteller : Aavid Thermalloy | Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 12.2C/W Black Anodized |
Produkt ist nicht verfügbar |
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375024B00032G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm Width: 40mm Length: 40mm Material: aluminium Colour: black Height: 18mm Application: BGA; FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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375024B00032G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm Width: 40mm Length: 40mm Material: aluminium Colour: black Height: 18mm Application: BGA; FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized |
Produkt ist nicht verfügbar |