375024B00032G Boyd Laconia, LLC
Hersteller: Boyd Laconia, LLCDescription: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 906 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 5.63 EUR |
| 10+ | 4.98 EUR |
| 25+ | 4.74 EUR |
| 50+ | 4.57 EUR |
| 100+ | 4.41 EUR |
| 450+ | 4.07 EUR |
| 900+ | 3.92 EUR |
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Technische Details 375024B00032G Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE, Packaging: Bulk, Material: Aluminum, Length: 1.575" (40.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.575" (40.01mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 2.0W @ 30°C, Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM, Thermal Resistance @ Natural: 12.00°C/W, Fin Height: 0.709" (18.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 375024B00032G nach Preis ab 5.77 EUR bis 8.48 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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375024B00032G | Hersteller : Aavid |
Heat Sinks Heat Sink for Metal/Ceramic BGA Packages, Black, 40x40x18mm, IC=40x40, Tape #32 |
auf Bestellung 899 Stücke: Lieferzeit 375-379 Tag (e) |
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375024B00032G Produktcode: 126372
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Verstärkungs- und Metallstangen > Radiatoren |
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375024B00032G | Hersteller : Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 12.2°C/W Black Anodized |
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375024B00032G | Hersteller : Aavid Thermalloy |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 12.2C/W Black Anodized |
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| 375024B00032G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm Material: aluminium Length: 40mm Width: 40mm Height: 18mm Application: BGA; FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized Colour: black Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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| 375024B00032G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm Material: aluminium Length: 40mm Width: 40mm Height: 18mm Application: BGA; FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized Colour: black |
Produkt ist nicht verfügbar |