375124B60024G Aavid
Hersteller: Aavid
Heat Sinks Heat Sink with BGA Solder Anchor, 40x40x25mm, Black, 2 Anchors, IC Pkg=42 x 40
| Anzahl | Privatkunde |
|---|---|
| 1+ | 8.04 EUR |
| 504+ | 7.91 EUR |
| 1008+ | 7.63 EUR |
| 2520+ | 7.27 EUR |
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Technische Details 375124B60024G Aavid
Description: HEATSINK BGA W/O SOLDER ANCHORS, Material Finish: Black Anodized, Fin Height: 0.984" (25.00mm), Thermal Resistance @ Natural: 10.30°C/W, Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 8.0W @ 80°C, Attachment Method: Solder Anchor, Package Cooled: BGA, Width: 1.575" (40.01mm), Type: Board Level, Shape: Square, Pin Fins, Length: 1.575" (40.00mm), Material: Aluminum, Packaging: Bulk.
Weitere Produktangebote 375124B60024G
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
375124B60024G | Boyd Laconia, LLC |
Description: HEATSINK BGA W/O SOLDER ANCHORS Material Finish: Black Anodized Fin Height: 0.984" (25.00mm) Thermal Resistance @ Natural: 10.30°C/W Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 8.0W @ 80°C Attachment Method: Solder Anchor Package Cooled: BGA Width: 1.575" (40.01mm) Type: Board Level Shape: Square, Pin Fins Length: 1.575" (40.00mm) Material: Aluminum Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 672 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 375124B60024G |
|
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/O SOLDER ANCHORS
Material Finish: Black Anodized
Fin Height: 0.984" (25.00mm)
Thermal Resistance @ Natural: 10.30°C/W
Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 8.0W @ 80°C
Attachment Method: Solder Anchor
Package Cooled: BGA
Width: 1.575" (40.01mm)
Type: Board Level
Shape: Square, Pin Fins
Length: 1.575" (40.00mm)
Material: Aluminum
Packaging: Bulk
Description: HEATSINK BGA W/O SOLDER ANCHORS
Material Finish: Black Anodized
Fin Height: 0.984" (25.00mm)
Thermal Resistance @ Natural: 10.30°C/W
Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 8.0W @ 80°C
Attachment Method: Solder Anchor
Package Cooled: BGA
Width: 1.575" (40.01mm)
Type: Board Level
Shape: Square, Pin Fins
Length: 1.575" (40.00mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 672 Stücke
Im Einkaufswagen
Stück im Wert von UAH