375124B60024G Boyd Corporation
auf Bestellung 6364 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 18+ | 8.40 EUR |
| 25+ | 7.15 EUR |
| 100+ | 5.98 EUR |
| 500+ | 5.51 EUR |
| 1000+ | 5.19 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 375124B60024G Boyd Corporation
Description: HEATSINK BGA W/O SOLDER ANCHORS, Packaging: Bulk, Material: Aluminum, Length: 1.575" (40.00mm), Shape: Square, Pin Fins, Type: Board Level, Width: 1.575" (40.01mm), Package Cooled: BGA, Attachment Method: Solder Anchor, Power Dissipation @ Temperature Rise: 8.0W @ 80°C, Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM, Thermal Resistance @ Natural: 10.30°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized.
Weitere Produktangebote 375124B60024G nach Preis ab 6.99 EUR bis 9.93 EUR
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375124B60024G | Hersteller : Boyd Corporation |
 Heat Sink Passive BGA Pin Array Clip Aluminum 10.3°C/W Black Anodized |
auf Bestellung 6364 Stücke: Lieferzeit 14-21 Tag (e) |
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375124B60024G | Hersteller : Aavid |
Heat Sinks Heat Sink with BGA Solder Anchor, 40x40x25mm, Black, 2 Anchors, IC Pkg=42 x 40 |
auf Bestellung 370 Stücke: Lieferzeit 10-14 Tag (e) |
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375124B60024G | Hersteller : Aavid Thermalloy |
Heat Sink Passive BGA Pin Array Clip Aluminum 10.3C/W Black Anodized |
auf Bestellung 2352 Stücke: Lieferzeit 14-21 Tag (e) |
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| 375124B60024G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm Colour: black Width: 40mm Material: aluminium Height: 25mm Length: 40mm Application: BGA; FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized Anzahl je Verpackung: 672 Stücke |
Produkt ist nicht verfügbar |
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375124B60024G | Hersteller : Boyd Laconia, LLC |
Description: HEATSINK BGA W/O SOLDER ANCHORS Packaging: Bulk Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Pin Fins Type: Board Level Width: 1.575" (40.01mm) Package Cooled: BGA Attachment Method: Solder Anchor Power Dissipation @ Temperature Rise: 8.0W @ 80°C Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM Thermal Resistance @ Natural: 10.30°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
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| 375124B60024G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm Colour: black Width: 40mm Material: aluminium Height: 25mm Length: 40mm Application: BGA; FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized |
Produkt ist nicht verfügbar |