375424B00034G Boyd Corporation
Hersteller: Boyd Corporation
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
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Technische Details 375424B00034G Boyd Corporation
Description: HEATSINK PIN-FIN W/TAPE, Packaging: Bulk, Material: Aluminum, Length: 0.598" (15.19mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.598" (15.19mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM, Thermal Resistance @ Natural: 62.50°C/W, Fin Height: 0.252" (6.40mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 375424B00034G nach Preis ab 1.46 EUR bis 2.45 EUR
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375424B00034G | Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized |
auf Bestellung 3360 Stücke: Lieferzeit 14-21 Tag (e) |
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375424B00034G | Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized |
auf Bestellung 3260 Stücke: Lieferzeit 14-21 Tag (e) |
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375424B00034G | Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized |
auf Bestellung 3260 Stücke: Lieferzeit 14-21 Tag (e) |
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375424B00034G | Boyd Laconia, LLC |
Description: HEATSINK PIN-FIN W/TAPE Packaging: Bulk Material: Aluminum Length: 0.598" (15.19mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.598" (15.19mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM Thermal Resistance @ Natural: 62.50°C/W Fin Height: 0.252" (6.40mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 901 Stücke: Lieferzeit 10-14 Tag (e) |
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| 375424B00034G |
|
Hersteller: Boyd Corporation
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
auf Bestellung 3360 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3360+ | 1.46 EUR |
| 375424B00034G |
|
Hersteller: Boyd Corporation
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
auf Bestellung 3260 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 93+ | 1.89 EUR |
| 375424B00034G |
|
Hersteller: Boyd Corporation
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
auf Bestellung 3260 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 93+ | 1.89 EUR |
| 375424B00034G |
|
Hersteller: Boyd Laconia, LLC
Description: HEATSINK PIN-FIN W/TAPE
Packaging: Bulk
Material: Aluminum
Length: 0.598" (15.19mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.598" (15.19mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 62.50°C/W
Fin Height: 0.252" (6.40mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK PIN-FIN W/TAPE
Packaging: Bulk
Material: Aluminum
Length: 0.598" (15.19mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.598" (15.19mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 62.50°C/W
Fin Height: 0.252" (6.40mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 901 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 9+ | 2.45 EUR |
| 10+ | 2.17 EUR |
| 25+ | 2.07 EUR |
| 50+ | 1.99 EUR |
| 100+ | 1.92 EUR |
| 250+ | 1.83 EUR |
| 500+ | 1.76 EUR |