375424B00034G Boyd Corporation
Hersteller: Boyd Corporation
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
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Technische Details 375424B00034G Boyd Corporation
Description: HEATSINK PIN-FIN W/TAPE, Packaging: Bulk, Material: Aluminum, Length: 0.598" (15.19mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.598" (15.19mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM, Thermal Resistance @ Natural: 62.50°C/W, Fin Height: 0.252" (6.40mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 375424B00034G nach Preis ab 1.42 EUR bis 2.43 EUR
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375424B00034G | Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized |
auf Bestellung 3360 Stücke: Lieferzeit 14-21 Tag (e) |
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375424B00034G | Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized |
auf Bestellung 98 Stücke: Lieferzeit 14-21 Tag (e) |
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375424B00034G | Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized |
auf Bestellung 3260 Stücke: Lieferzeit 14-21 Tag (e) |
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375424B00034G | Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized |
auf Bestellung 3260 Stücke: Lieferzeit 14-21 Tag (e) |
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375424B00034G | Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized |
auf Bestellung 3360 Stücke: Lieferzeit 14-21 Tag (e) |
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375424B00034G | Boyd Laconia, LLC |
Description: HEATSINK PIN-FIN W/TAPE Packaging: Bulk Material: Aluminum Length: 0.598" (15.19mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.598" (15.19mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM Thermal Resistance @ Natural: 62.50°C/W Fin Height: 0.252" (6.40mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 6767 Stücke: Lieferzeit 10-14 Tag (e) |
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375424B00034G | Aavid |
Heat Sinks Heat Sink for Plastic BGA Packages, Black, 15.2x15.2x6.4mm, IC=15x15, Tape #34 |
auf Bestellung 8692 Stücke: Lieferzeit 10-14 Tag (e) |
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| 375424B00034G |
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Hersteller: Boyd Corporation
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
auf Bestellung 3360 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3360+ | 1.42 EUR |
| 375424B00034G |
|
Hersteller: Boyd Corporation
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
auf Bestellung 98 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 94+ | 1.82 EUR |
| 375424B00034G |
|
Hersteller: Boyd Corporation
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
auf Bestellung 3260 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 93+ | 1.83 EUR |
| 375424B00034G |
|
Hersteller: Boyd Corporation
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
auf Bestellung 3260 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 93+ | 1.83 EUR |
| 375424B00034G |
|
Hersteller: Boyd Corporation
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
auf Bestellung 3360 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3360+ | 1.9 EUR |
| 375424B00034G |
|
Hersteller: Boyd Laconia, LLC
Description: HEATSINK PIN-FIN W/TAPE
Packaging: Bulk
Material: Aluminum
Length: 0.598" (15.19mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.598" (15.19mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 62.50°C/W
Fin Height: 0.252" (6.40mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK PIN-FIN W/TAPE
Packaging: Bulk
Material: Aluminum
Length: 0.598" (15.19mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.598" (15.19mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 62.50°C/W
Fin Height: 0.252" (6.40mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 6767 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 9+ | 2.4 EUR |
| 10+ | 2.12 EUR |
| 25+ | 2.01 EUR |
| 50+ | 1.94 EUR |
| 100+ | 1.87 EUR |
| 250+ | 1.78 EUR |
| 500+ | 1.71 EUR |
| 3360+ | 1.56 EUR |
| 6720+ | 1.5 EUR |
| 375424B00034G |
|
Hersteller: Aavid
Heat Sinks Heat Sink for Plastic BGA Packages, Black, 15.2x15.2x6.4mm, IC=15x15, Tape #34
Heat Sinks Heat Sink for Plastic BGA Packages, Black, 15.2x15.2x6.4mm, IC=15x15, Tape #34
auf Bestellung 8692 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.43 EUR |
| 10+ | 2.18 EUR |
| 25+ | 2.09 EUR |
| 50+ | 2 EUR |
| 100+ | 1.93 EUR |
| 250+ | 1.83 EUR |
| 500+ | 1.77 EUR |