375424B00034G Boyd Corporation
Hersteller: Boyd Corporation
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
| Anzahl | Preis |
|---|---|
| 3360+ | 1.19 EUR |
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Technische Details 375424B00034G Boyd Corporation
Description: HEATSINK PIN-FIN W/TAPE, Packaging: Bulk, Material: Aluminum, Length: 0.598" (15.19mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.598" (15.19mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM, Thermal Resistance @ Natural: 62.50°C/W, Fin Height: 0.252" (6.40mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 375424B00034G nach Preis ab 1.19 EUR bis 2.08 EUR
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375424B00034G | Hersteller : Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized |
auf Bestellung 3360 Stücke: Lieferzeit 14-21 Tag (e) |
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375424B00034G | Hersteller : Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized |
auf Bestellung 3260 Stücke: Lieferzeit 14-21 Tag (e) |
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375424B00034G | Hersteller : Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized |
auf Bestellung 3260 Stücke: Lieferzeit 14-21 Tag (e) |
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375424B00034G | Hersteller : Aavid |
Heat Sinks Heat Sink for Plastic BGA Packages, Black, 15.2x15.2x6.4mm, IC=15x15, Tape #34 |
auf Bestellung 1159 Stücke: Lieferzeit 10-14 Tag (e) |
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375424B00034G | Hersteller : Boyd Laconia, LLC |
Description: HEATSINK PIN-FIN W/TAPE Packaging: Bulk Material: Aluminum Length: 0.598" (15.19mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.598" (15.19mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM Thermal Resistance @ Natural: 62.50°C/W Fin Height: 0.252" (6.40mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 9718 Stücke: Lieferzeit 10-14 Tag (e) |
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| 375424B00034G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 15.3mm; W: 15.2mm Material: aluminium Colour: black Type of heatsink: extruded Heatsink shape: grilled Height: 6.35mm Width: 15.2mm Length: 15.3mm Material finishing: anodized Application: BGA; FPGA |
Produkt ist nicht verfügbar |