4-1571551-3 TE Connectivity
auf Bestellung 4726 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 68+ | 2.22 EUR |
| 272+ | 2.1 EUR |
| 476+ | 1.99 EUR |
| 918+ | 1.88 EUR |
| 1360+ | 1.76 EUR |
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Technische Details 4-1571551-3 TE Connectivity
Description: CONN IC DIP SOCKET 14POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 25.0µin (0.63µm), Contact Material - Post: Nickel.
Weitere Produktangebote 4-1571551-3
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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4-1571551-3 | Hersteller : TE Connectivity |
 IC & Component Sockets SOLID FRAME PC 14P |
auf Bestellung 1422 Stücke: Lieferzeit 10-14 Tag (e) |
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| 4-1571551-3 | Hersteller : TE CONNECTIVITY / PARTNER STOCK |
Description: TE CONNECTIVITY / PARTNER STOCK - 4-1571551-3 - IC COMPONENT SOCKETS CONNECTORS tariffCode: 85366990 productTraceability: No rohsCompliant: YES euEccn: NLR hazardous: false rohsPhthalatesCompliant: YES usEccn: EAR99 SVHC: To Be Advised |
auf Bestellung 3808 Stücke: Lieferzeit 14-21 Tag (e) |
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 |
4-1571551-3 | Hersteller : TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 14POS GOLD Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25.0µin (0.63µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 25.0µin (0.63µm) Contact Material - Post: Nickel |
Produkt ist nicht verfügbar |