40-516-11S Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 46.81 EUR |
| 10+ | 38.12 EUR |
| 20+ | 36.6 EUR |
| 50+ | 35.63 EUR |
| 100+ | 33.4 EUR |
| 200+ | 32.49 EUR |
| 500+ | 32.02 EUR |
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Technische Details 40-516-11S Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS GLD, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 40 (2 x 20), Type: DIP, ZIF (ZIP), Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote 40-516-11S nach Preis ab 42.83 EUR bis 42.83 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
| 40-516-11S | Aries Electronics |
 Description: CONN IC DIP SOCKET ZIF 40POS GLDPart Status: Active Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 40 (2 x 20) Type: DIP, ZIF (ZIP) Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 40-516-11S |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Type: DIP, ZIF (ZIP)
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 42.83 EUR |