40-6554-10 Aries Electronics
Hersteller: Aries ElectronicsDescription: CONN IC DIP SOCKET ZIF 40POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 97 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 28.97 EUR |
| 14+ | 24.05 EUR |
| 28+ | 22.9 EUR |
| 56+ | 21.81 EUR |
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Technische Details 40-6554-10 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 40-6554-10
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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40-6554-10 | Hersteller : ARIES |
Description: ARIES - 40-6554-10 - IC- & Baustein-Sockel, 40 Kontakt(e), DIP-Sockel, 2.54 mm, X55X, 15.24 mm, Berylliumkupfer tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Berylliumkupfer isCanonical: Y usEccn: EAR99 Anzahl der Kontakte: 40Kontakt(e) euEccn: NLR Reihenabstand: 15.24mm Steckverbinder: DIP-Sockel Produktpalette: X55X productTraceability: No Rastermaß: 2.54mm SVHC: No SVHC (15-Jan-2018) |
auf Bestellung 3 Stücke: Lieferzeit 14-21 Tag (e) |
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40-6554-10 | Hersteller : Aries Electronics |
IC & Component Sockets 40P TEST SOCKET TIN |
Produkt ist nicht verfügbar |