40-6554-10 Aries Electronics
auf Bestellung 147 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 27.84 EUR |
| 7+ | 25.80 EUR |
| 28+ | 23.16 EUR |
| 56+ | 22.81 EUR |
| 105+ | 22.30 EUR |
| 252+ | 19.89 EUR |
| 504+ | 19.50 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 40-6554-10 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS TIN, Packaging: Tube, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 40-6554-10 nach Preis ab 21.36 EUR bis 28.37 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
40-6554-10 | Hersteller : Aries Electronics |
 Description: CONN IC DIP SOCKET ZIF 40POS TINPackaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 70 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
 |
40-6554-10 | Hersteller : ARIES |
Description: ARIES - 40-6554-10 - IC- & Baustein-Sockel, 40 Kontakt(e), DIP-Sockel, 2.54 mm, X55X, 15.24 mm, Berylliumkupfer tariffCode: 85366930 productTraceability: No Kontaktüberzug: Verzinnte Kontakte Steckverbindertyp: DIP-Sockel rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 40Kontakt(e) euEccn: NLR Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 15.24mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: X55X SVHC: No SVHC (15-Jan-2018) |
auf Bestellung 162 Stücke: Lieferzeit 14-21 Tag (e) |