40-6574-10 ARIES
Hersteller: ARIESDescription: ARIES - 40-6574-10 - IC- & Baustein-Sockel, 40 Kontakt(e), DIP, 2.54 mm, 6574, 15.24 mm, Berylliumkupfer
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Verzinnte Kontakte
Steckverbindertyp: DIP
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 40Contacts
euEccn: NLR
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: 15.24mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: 6574
SVHC: No SVHC
auf Bestellung 1 Stücke:
Lieferzeit 14-21 Tag (e)
Produktrezensionen
Produktbewertung abgeben
Technische Details 40-6574-10 ARIES
Description: CONN IC DIP SOCKET ZIF 40POS TIN, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 40 (2 x 20), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 40-6574-10
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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40-6574-10 Produktcode: 53959 |
Steckverbinder, Reihenklemmen > Plattenverbinder |
Produkt ist nicht verfügbar
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40-6574-10 | Hersteller : Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 40POS TIN Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
Produkt ist nicht verfügbar |
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40-6574-10 | Hersteller : Aries Electronics |
IC & Component Sockets 40P UNIV 21F SOCKET |
Produkt ist nicht verfügbar |