Hersteller: Microchip Technology
Description: IC ADC 13BIT SAR 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Bits: 13
Configuration: MUX-S/H-ADC
Data Interface: SPI
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 100k
Input Type: Differential, Single Ended
Number of Inputs: 4, 8
Supplier Device Package: 16-SOIC
Architecture: SAR
Ratio - S/H:ADC: 1:1
Part Status: Active
Number of A/D Converters: 1

Hersteller: MICROCHIP
Description: MICROCHIP - MCP3304-CI/SL - Analog/Digital-Wandler, Vierfach, 13 bit, 100 kSPS, Differenz, asymmetrisch, Seriell, SPI, Einfach
tariffCode: 85423990
rohsCompliant: YES
Datenschnittstelle: Seriell, SPI
hazardous: false
rohsPhthalatesCompliant: YES
Abtastrate: 100kSPS
Bauform - ADC / DAC: SOIC
MSL: MSL 1 - unbegrenzt
usEccn: EAR99
Betriebstemperatur, min.: -40°C
Versorgungsspannung, min.: 4.5V
Versorgungsspannung: Einfach
Eingangskanaltyp: Differenz, asymmetrisch
euEccn: NLR
Qualifizierungsstandard der Automobilindustrie: AEC-Q100
Anzahl der Pins: 16Pin(s)
Produktpalette: Quad 13-Bit SAR ADCs
productTraceability: Yes-Date/Lot Code
Versorgungsspannung, max.: 5.5V
Betriebstemperatur, max.: 85°C
Auflösung (Bit): 13bit
SVHC: No SVHC (25-Jun-2025)

Hersteller: Laird-Signal Integrity Products
Description: FIXED IND 150UH 850MA 410MOHM SM
Packaging: Tape & Reel (TR)
Tolerance: ±20%
Package / Case: Nonstandard
Size / Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Mounting Type: Surface Mount
Shielding: Shielded
Operating Temperature: -40°C ~ 125°C
DC Resistance (DCR): 410mOhm Max
Frequency - Self Resonant: 3.5MHz
Current - Saturation (Isat): 1.1A
Material - Core: Ferrite
Inductance Frequency - Test: 100 kHz
Height - Seated (Max): 0.165" (4.20mm)
Inductance: 150 µH
Current Rating (Amps): 850 mA

Hersteller: Laird-Signal Integrity Products
Description: FIXED IND 150UH 850MA 410MOHM SM
Packaging: Cut Tape (CT)
Tolerance: ±20%
Package / Case: Nonstandard
Size / Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Mounting Type: Surface Mount
Shielding: Shielded
Operating Temperature: -40°C ~ 125°C
DC Resistance (DCR): 410mOhm Max
Frequency - Self Resonant: 3.5MHz
Current - Saturation (Isat): 1.1A
Material - Core: Ferrite
Inductance Frequency - Test: 100 kHz
Height - Seated (Max): 0.165" (4.20mm)
Inductance: 150 µH
Current Rating (Amps): 850 mA

Hersteller: SICK, Inc.
Description: HUELSE
Packaging: Box

Hersteller: Vishay Dale
Description: RES SMD 7.5K OHM 5% 1/16W 0402
Packaging: Tape & Reel (TR)
Power (Watts): 0.063W, 1/16W
Tolerance: ±5%
Features: Automotive AEC-Q200
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: ±200ppm/°C
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Composition: Thick Film
Operating Temperature: -55°C ~ 155°C
Ratings: AEC-Q200
Number of Terminations: 2
Supplier Device Package: 0402
Height - Seated (Max): 0.016" (0.40mm)
Resistance: 7.5 kOhms

Hersteller: NXP USA Inc.
Description: XTRINSIC 2 AXIS HIGH/HIGH XZ ACC
Packaging: Tape & Reel (TR)

Hersteller: NXP Semiconductors
Accelerometers 2 Axis High/High XZ Accelerometer

Hersteller: Texas Instruments
Description: IC CLK BUFFER 3:7 3.1GHZ 36WQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-WFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: HCSL, LVCMOS, LVDS, LVPECL
Type: Fanout Buffer (Distribution), Multiplexer, Translator
Input: CML, HCSL, HSTL, LVDS, LVPECL, SSTL, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.15V ~ 3.45V
Ratio - Input:Output: 3:7
Differential - Input:Output: Yes/Yes
Supplier Device Package: 36-WQFN (6x6)
Frequency - Max: 3.1 GHz

Hersteller: Texas Instruments
Description: IC CLK BUFFER 3:7 3.1GHZ 36WQFN
Packaging: Cut Tape (CT)
Package / Case: 36-WFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: HCSL, LVCMOS, LVDS, LVPECL
Type: Fanout Buffer (Distribution), Multiplexer, Translator
Input: CML, HCSL, HSTL, LVDS, LVPECL, SSTL, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.15V ~ 3.45V
Ratio - Input:Output: 3:7
Differential - Input:Output: Yes/Yes
Supplier Device Package: 36-WQFN (6x6)
Frequency - Max: 3.1 GHz

Hersteller: NXP USA Inc.
Description: S32M243CCABWKHSR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100

Hersteller: NXP Semiconductors
ARM Microcontrollers - MCU S32M2 MC IS, CM4, 80MHz, 256K Flash, CAN