Suchergebnisse für "4106811" : 10
Art der Ansicht :
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| 510-41-068-11-001001 | Mill-Max |
 IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET |
Produkt ist nicht verfügbar |
||
| 510-41-068-11-001001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 68 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
||
| 510-41-068-11-061001 | Mill-Max |
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET |
Produkt ist nicht verfügbar |
||
| 510-41-068-11-061001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 68 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
||
| 511-41-068-11-061001 | Mill-Max |
Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET |
Produkt ist nicht verfügbar |
||
| 511-41-068-11-061001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 68 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
||
| 523-41-068-11-061001 | Mill-Max |
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET |
Produkt ist nicht verfügbar |
||
| 523-41-068-11-061001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 68 (11 x 11) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Pitch - Post: 0.100" (2.54mm) |
Produkt ist nicht verfügbar |
||
| 510-91-068-11-001001 | Mill-Max |
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET |
Produkt ist nicht verfügbar |
||
| 510-91-068-11-061001 | Mill-Max |
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET |
Produkt ist nicht verfügbar |
| 510-41-068-11-001001 |
|
Hersteller: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
Produkt ist nicht verfügbar
| 510-41-068-11-001001 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 68 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 68 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
| 510-41-068-11-061001 |
|
Hersteller: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
Produkt ist nicht verfügbar
| 510-41-068-11-061001 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 68 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 68 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
| 511-41-068-11-061001 |
|
Hersteller: Mill-Max
Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET
Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET
Produkt ist nicht verfügbar
| 511-41-068-11-061001 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 68 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 68 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
| 523-41-068-11-061001 |
|
Hersteller: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
Produkt ist nicht verfügbar
| 523-41-068-11-061001 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 68 (11 x 11)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Pitch - Post: 0.100" (2.54mm)
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 68 (11 x 11)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Pitch - Post: 0.100" (2.54mm)
Produkt ist nicht verfügbar
| 510-91-068-11-001001 |
|
Hersteller: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
Produkt ist nicht verfügbar
| 510-91-068-11-061001 |
|
Hersteller: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
Produkt ist nicht verfügbar