auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 359.04 EUR |
| 10+ | 332.71 EUR |
| 25+ | 320.72 EUR |
| 50+ | 318.35 EUR |
| 250+ | 313.09 EUR |
| 500+ | 313.07 EUR |
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Technische Details 44-547-11 Aries Electronics
Description: CONN SOCKET SOIC ZIF 44POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: SOIC, ZIF (ZIP), Number of Positions or Pins (Grid): 44 (2 x 22), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 20.0µin (0.51µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 44-547-11 nach Preis ab 386.07 EUR bis 386.07 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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44-547-11 | Hersteller : Aries Electronics |
 Description: CONN SOCKET SOIC ZIF 44POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SOIC, ZIF (ZIP) Number of Positions or Pins (Grid): 44 (2 x 22) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 20.0µin (0.51µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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