44-547-11E Aries Electronics

Description: CONN SOCKET SOIC ZIF 44POS GOLD, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 20.0µin (0.51µm), Contact Finish - Post: Gold, Pitch - Post: 0.050" (1.27mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Mating: Gold, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 44 (2 x 22), Type: SOIC, ZIF (ZIP), Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.