4605X-101-304LF Bourns
Hersteller: BournsRes Thick Film NET 300K Ohm 2% 0.63W ±100ppm/C BUS Conformal Coated 5-Pin SIP Pin Thru-Hole Bulk
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Technische Details 4605X-101-304LF Bourns
Description: RES ARRAY 4 RES 300K OHM 5SIP, Resistance (Ohms): 300k, Tolerance: ±2%, Packaging: Bulk, Power Per Element: 200mW, Circuit Type: Bussed, Number of Pins: 5, Package / Case: 5-SIP, Temperature Coefficient: ±100ppm/°C, Size / Dimension: 0.498" L x 0.098" W (12.65mm x 2.49mm), Mounting Type: Through Hole, Operating Temperature: -55°C ~ 125°C, Supplier Device Package: 5-SIP, Height - Seated (Max): 0.200" (5.08mm), Number of Resistors: 4.
Weitere Produktangebote 4605X-101-304LF
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4605X-101-304LF | Hersteller : Bourns Inc. |
Description: RES ARRAY 4 RES 300K OHM 5SIP Resistance (Ohms): 300k Tolerance: ±2% Packaging: Bulk Power Per Element: 200mW Circuit Type: Bussed Number of Pins: 5 Package / Case: 5-SIP Temperature Coefficient: ±100ppm/°C Size / Dimension: 0.498" L x 0.098" W (12.65mm x 2.49mm) Mounting Type: Through Hole Operating Temperature: -55°C ~ 125°C Supplier Device Package: 5-SIP Height - Seated (Max): 0.200" (5.08mm) Number of Resistors: 4 |
Produkt ist nicht verfügbar |
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4605X-101-304LF | Hersteller : Bourns |
Resistor Networks & Arrays THICK FILM 2% 300K CONFRML SIP |
Produkt ist nicht verfügbar |