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48-3553-11

48-3553-11 Aries Electronics

10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT GOLD 48 PINS
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+149.94 EUR
12+133.71 EUR
30+128.56 EUR
54+124.26 EUR
102+117.39 EUR
Im Einkaufswagen  Stück im Wert von  UAH
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Technische Details 48-3553-11 Aries Electronics

Description: CONN IC DIP SOCKET ZIF 48POS GLD, Contact Material - Post: Beryllium Copper, Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 48 (2 x 24), Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.

Weitere Produktangebote 48-3553-11

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
48-3553-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 48POS GLD
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
 Mindestbestellmenge: 18 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
48-3553-11 10001-universal-dip-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 48 (2 x 24)
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 18 Stücke
Im Einkaufswagen  Stück im Wert von  UAH