Produkte > ARIES ELECTRONICS > 48-6572-10
48-6572-10

48-6572-10 Aries Electronics

10019-universal-zif-test-and-burn-in-socket-336489.pdf Hersteller: Aries Electronics
IC & Component Sockets QUICK RELEASE 48 PIN TIN
auf Bestellung 4 Stücke:
Lieferzeit 14-28 Tag (e)
Anzahl Preis ohne MwSt
1+58.99 EUR
12+ 53.82 EUR
30+ 52.62 EUR
54+ 51.74 EUR
102+ 50.88 EUR
252+ 49.22 EUR
504+ 48.13 EUR
Produktrezensionen
Produktbewertung abgeben

Technische Details 48-6572-10 Aries Electronics

Description: CONN IC DIP SOCKET ZIF 48POS GLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Number of Positions or Pins (Grid): 48 (2 x 24), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper.

Weitere Produktangebote 48-6572-10

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
48-6572-10 Hersteller : Aries Electronics 10019-universal-zif-test-and-burn-in-socket.pdf Description: CONN IC DIP SOCKET ZIF 48POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar