Technische Details 5-1437539-3 TE Connectivity
Description: CONN IC DIP SOCKET 20POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 5.00µin (0.127µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm).
Weitere Produktangebote 5-1437539-3
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| 5-1437539-3 | Hersteller : TE Connectivity AMP Connectors |
 Description: CONN IC DIP SOCKET 20POS GOLDPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 5.00µin (0.127µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) |
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