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502006B00000G

502006B00000G Boyd Corporation

board-level-cooling-diamond-basket-5010.pdf Hersteller: Boyd Corporation
Heat Sink Passive TO-66 Screw Mount Aluminum 8°C/W Black Anodized
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Technische Details 502006B00000G Boyd Corporation

Description: BOARD LEVEL HEAT SINK, Packaging: Bulk, Material: Aluminum, Length: 1.550" (39.37mm), Shape: Rhombus, Type: Board Level, Width: 1.040" (26.42mm), Package Cooled: TO-66, Attachment Method: Bolt On, Power Dissipation @ Temperature Rise: 7.0W @ 50°C, Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 200 LFM, Thermal Resistance @ Natural: 8.00°C/W, Fin Height: 1.250" (31.75mm), Material Finish: Black Anodized.

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502006B00000G Hersteller : Boyd Laconia, LLC Board-Level-Cooling-Diamond-Basket-5010.pdf Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.550" (39.37mm)
Shape: Rhombus
Type: Board Level
Width: 1.040" (26.42mm)
Package Cooled: TO-66
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 7.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 8.00°C/W
Fin Height: 1.250" (31.75mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
502006B00000G 502006B00000G Hersteller : Aavid Aavid_01112021_Board_Level_Cooling_Diamond_Basket_-1953718.pdf Heat Sinks Diamond Shaped, Basket Heat Sink for TO-66, Horizontal, 8 Degree C/W, 31.75mm
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