5020463070 Molex
Hersteller: Molex
Description: CONN RCPT 30P 0.049 GOLD SMD R/A
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Voltage Rating: 50V
Current Rating (Amps): 1A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 30
Style: Board to Cable/Wire
Operating Temperature: -25°C ~ 85°C
Contact Type: Forked
Fastening Type: Detent Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.90µin (0.099µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.295" (7.50mm)
Number of Rows: 2
| Anzahl | Privatkunde |
|---|---|
| 650+ | 2.92 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Mindestmenge:
650 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details 5020463070 Molex
Description: CONN RCPT 30P 0.049 GOLD SMD R/A, Features: Pick and Place, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Voltage Rating: 50V, Current Rating (Amps): 1A, Mounting Type: Surface Mount, Right Angle, Number of Positions: 30, Style: Board to Cable/Wire, Operating Temperature: -25°C ~ 85°C, Contact Type: Forked, Fastening Type: Detent Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Natural, Pitch - Mating: 0.049" (1.25mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.90µin (0.099µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.295" (7.50mm), Number of Rows: 2.
Weitere Produktangebote 5020463070 nach Preis ab 3.58 EUR bis 7.39 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
5020463070 | Molex |
Conn Wire to Board RCP 30 POS 1.25mm Solder RA Side Entry SMD Duo-Clasp T/R |
auf Bestellung 650 Stücke: Lieferzeit 14-21 Tag (e) |
|
||||||||||||
|
|
5020463070 | Molex |
Description: CONN RCPT 30P 0.049 GOLD SMD R/A Features: Pick and Place, Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle Voltage Rating: 50V Current Rating (Amps): 1A Mounting Type: Surface Mount, Right Angle Number of Positions: 30 Style: Board to Cable/Wire Operating Temperature: -25°C ~ 85°C Contact Type: Forked Fastening Type: Detent Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Natural Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.90µin (0.099µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.295" (7.50mm) Number of Rows: 2 |
auf Bestellung 23948 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
502046-3070 | Molex |
Headers & Wire Housings 1.25 W/B R/A Rec 30C kt EmbsTp Pkg |
auf Bestellung 82 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 5020463070 |
|
Hersteller: Molex
Conn Wire to Board RCP 30 POS 1.25mm Solder RA Side Entry SMD Duo-Clasp T/R
Conn Wire to Board RCP 30 POS 1.25mm Solder RA Side Entry SMD Duo-Clasp T/R
auf Bestellung 650 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 264+ | 4.51 EUR |
| 5020463070 |
|
Hersteller: Molex
Description: CONN RCPT 30P 0.049 GOLD SMD R/A
Features: Pick and Place, Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Voltage Rating: 50V
Current Rating (Amps): 1A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 30
Style: Board to Cable/Wire
Operating Temperature: -25°C ~ 85°C
Contact Type: Forked
Fastening Type: Detent Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.90µin (0.099µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.295" (7.50mm)
Number of Rows: 2
Description: CONN RCPT 30P 0.049 GOLD SMD R/A
Features: Pick and Place, Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Voltage Rating: 50V
Current Rating (Amps): 1A
Mounting Type: Surface Mount, Right Angle
Number of Positions: 30
Style: Board to Cable/Wire
Operating Temperature: -25°C ~ 85°C
Contact Type: Forked
Fastening Type: Detent Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.90µin (0.099µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.295" (7.50mm)
Number of Rows: 2
auf Bestellung 23948 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.43 EUR |
| 10+ | 4.9 EUR |
| 25+ | 4.45 EUR |
| 50+ | 4.15 EUR |
| 100+ | 3.89 EUR |
| 250+ | 3.58 EUR |
| 502046-3070 |
|
Hersteller: Molex
Headers & Wire Housings 1.25 W/B R/A Rec 30C kt EmbsTp Pkg
Headers & Wire Housings 1.25 W/B R/A Rec 30C kt EmbsTp Pkg
auf Bestellung 82 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 7.39 EUR |
| 10+ | 6.51 EUR |
| 100+ | 5.24 EUR |
| 650+ | 5.09 EUR |