auf Bestellung 2409 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 1 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 502585-1170 Molex
Description: CONN RCPT 11P 0.059 TIN SMD R/A, Packaging: Tape & Reel (TR), Features: Pick and Place, Solder Retention, Connector Type: Receptacle, Mounting Type: Surface Mount, Right Angle, Number of Positions: 11, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Forked, Fastening Type: Latch Holder, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Beige, Pitch - Mating: 0.059" (1.50mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 39.4µin (1.00µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.250" (6.35mm), Number of Rows: 1.
Weitere Produktangebote 502585-1170
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
5025851170 | Hersteller : Molex |
 Conn Wire to Board RCP 11 POS 1.5mm Solder RA SMD CLIK-Mate™ T/R |
Produkt ist nicht verfügbar |
|
 |
5025851170 | Hersteller : Molex |
Description: CONN RCPT 11P 0.059 TIN SMD R/A Packaging: Tape & Reel (TR) Features: Pick and Place, Solder Retention Connector Type: Receptacle Mounting Type: Surface Mount, Right Angle Number of Positions: 11 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Forked Fastening Type: Latch Holder Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Beige Pitch - Mating: 0.059" (1.50mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.250" (6.35mm) Number of Rows: 1 |
Produkt ist nicht verfügbar |