auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 49.46 EUR |
| 11+ | 43.33 EUR |
| 22+ | 41.45 EUR |
| 55+ | 40.11 EUR |
| 110+ | 38.77 EUR |
| 176+ | 36.63 EUR |
| 528+ | 35.57 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 510-83-280-19-081101 Preci-dip
Description: CONN SOCKET PGA 280POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 280 (19 x 19), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 510-83-280-19-081101
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
510-83-280-19-081101 | Hersteller : Preci-Dip |
 Pin grid array sockets, standard solder version |
Produkt ist nicht verfügbar |
|
| 510-83-280-19-081101 | Hersteller : Preci-Dip |
Description: CONN SOCKET PGA 280POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 280 (19 x 19) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |