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510-83-280-19-081101

510-83-280-19-081101 Preci-dip

Default.aspx?c=12&i=1061&p=267&pdf=1&dsku=510-PP-NNN-XX-XXX101
Hersteller: Preci-dip
IC & Component Sockets
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+87.08 EUR
11+74.02 EUR
22+72.15 EUR
55+66.63 EUR
110+65.32 EUR
176+63.27 EUR
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Technische Details 510-83-280-19-081101 Preci-dip

Description: CONN SOCKET PGA 280POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 280 (19 x 19), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass, Part Status: Active.

Weitere Produktangebote 510-83-280-19-081101

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
510-83-280-19-081101 Preci-Dip Default.aspx?c=12&i=1061&p=267&pdf=1&dsku=510-PP-NNN-XX-XXX101 Description: CONN SOCKET PGA 280POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 280 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 176 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
510-83-280-19-081101 Default.aspx?c=12&i=1061&p=267&pdf=1&dsku=510-PP-NNN-XX-XXX101
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 280POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 280 (19 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 176 Stücke
Im Einkaufswagen  Stück im Wert von  UAH