auf Bestellung 23 Stücke:
Lieferzeit 14-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 67.21 EUR |
| 11+ | 58.89 EUR |
| 22+ | 56.34 EUR |
| 55+ | 54.52 EUR |
| 110+ | 52.68 EUR |
| 176+ | 49.79 EUR |
| 528+ | 48.33 EUR |
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Technische Details 510-83-280-19-081101 Preci-dip
Description: CONN SOCKET PGA 280POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 280 (19 x 19), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 510-83-280-19-081101
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
 |
510-83-280-19-081101 | Hersteller : Preci-Dip |
 Pin grid array sockets, standard solder version |
Produkt ist nicht verfügbar |
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| 510-83-280-19-081101 | Hersteller : Preci-Dip |
Description: CONN SOCKET PGA 280POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 280 (19 x 19) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |