51646 QOLTEC

Hersteller: QOLTEC
Category: Heat conductive compounds
Description: Heat transfer paste; silver; 3.17W/mK; max.0.067°C/W; 0.5g
Kind of package: syringe
Thermal conductivity: 3.17W/mK
Agent features: easy aplication; perfect insulation; thermally conductive
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Type of chemical agent: heat transfer paste
Colour: silver
Thermal resistance: max. 0.067°C/W
Net weight: 0.5g

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Technische Details 51646 QOLTEC

Category: Heat conductive compounds, Description: Heat transfer paste; silver; 3.17W/mK; max.0.067°C/W; 0.5g, Kind of package: syringe, Thermal conductivity: 3.17W/mK, Agent features: easy aplication; perfect insulation; thermally conductive, Application: filling joints and micro-gaps between the processor and the base of the cooling system, Type of chemical agent: heat transfer paste, Colour: silver, Thermal resistance: max. 0.067°C/W, Net weight: 0.5g.