51647 QOLTEC
Hersteller: QOLTEC
Category: Heat conductive compounds
Description: Heat transfer paste; silver; 3.17W/mK; max.0.067°C/W; 5g
Colour: silver
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Agent features: easy aplication; perfect insulation; thermally conductive
Type of chemical agent: heat transfer paste
Kind of package: syringe
Thermal resistance: max. 0.067°C/W
Thermal conductivity: 3.17W/mK
Net weight: 5g
| Anzahl | Privatkunde |
|---|---|
| 15+ | 5.77 EUR |
| 16+ | 5.46 EUR |
| 17+ | 5.14 EUR |
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Technische Details 51647 QOLTEC
Category: Heat conductive compounds, Description: Heat transfer paste; silver; 3.17W/mK; max.0.067°C/W; 5g, Colour: silver, Application: filling joints and micro-gaps between the processor and the base of the cooling system, Agent features: easy aplication; perfect insulation; thermally conductive, Type of chemical agent: heat transfer paste, Kind of package: syringe, Thermal resistance: max. 0.067°C/W, Thermal conductivity: 3.17W/mK, Net weight: 5g.