51647 QOLTEC
Hersteller: QOLTEC
Category: Heat conductive compounds
Description: Heat transfer paste; silver; 3.17W/mK; max.0.067°C/W; 5g
Type of chemical agent: heat transfer paste
Colour: silver
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 3.17W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 5g
Thermal resistance: max. 0.067°C/W
Anzahl je Verpackung: 1 Stücke
Category: Heat conductive compounds
Description: Heat transfer paste; silver; 3.17W/mK; max.0.067°C/W; 5g
Type of chemical agent: heat transfer paste
Colour: silver
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 3.17W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 5g
Thermal resistance: max. 0.067°C/W
Anzahl je Verpackung: 1 Stücke
auf Bestellung 39 Stücke:
Lieferzeit 7-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 15+ | 4.83 EUR |
| 16+ | 4.56 EUR |
| 17+ | 4.29 EUR |
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Technische Details 51647 QOLTEC
Category: Heat conductive compounds, Description: Heat transfer paste; silver; 3.17W/mK; max.0.067°C/W; 5g, Type of chemical agent: heat transfer paste, Colour: silver, Agent features: easy aplication; perfect insulation; thermally conductive, Thermal conductivity: 3.17W/mK, Kind of package: syringe, Application: filling joints and micro-gaps between the processor and the base of the cooling system, Net weight: 5g, Thermal resistance: max. 0.067°C/W, Anzahl je Verpackung: 1 Stücke.
Weitere Produktangebote 51647 nach Preis ab 4.29 EUR bis 4.83 EUR
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51647 | Hersteller : QOLTEC |
Category: Heat conductive compounds Description: Heat transfer paste; silver; 3.17W/mK; max.0.067°C/W; 5g Type of chemical agent: heat transfer paste Colour: silver Agent features: easy aplication; perfect insulation; thermally conductive Thermal conductivity: 3.17W/mK Kind of package: syringe Application: filling joints and micro-gaps between the processor and the base of the cooling system Net weight: 5g Thermal resistance: max. 0.067°C/W |
auf Bestellung 39 Stücke: Lieferzeit 14-21 Tag (e) |
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