51653 QOLTEC
Hersteller: QOLTEC
Category: Heat conductive compounds
Description: Heat transfer paste; grey; 4.63W/mK; max.0.0087°C/W; 30g
Type of chemical agent: heat transfer paste
Colour: grey
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 4.63W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 30g
Thermal resistance: max. 0.0087°C/W
Anzahl je Verpackung: 1 Stücke
Category: Heat conductive compounds
Description: Heat transfer paste; grey; 4.63W/mK; max.0.0087°C/W; 30g
Type of chemical agent: heat transfer paste
Colour: grey
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 4.63W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 30g
Thermal resistance: max. 0.0087°C/W
Anzahl je Verpackung: 1 Stücke
auf Bestellung 34 Stücke:
Lieferzeit 7-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 6+ | 12.51 EUR |
| 7+ | 11.81 EUR |
| 10+ | 11.13 EUR |
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Technische Details 51653 QOLTEC
Category: Heat conductive compounds, Description: Heat transfer paste; grey; 4.63W/mK; max.0.0087°C/W; 30g, Type of chemical agent: heat transfer paste, Colour: grey, Agent features: easy aplication; perfect insulation; thermally conductive, Thermal conductivity: 4.63W/mK, Kind of package: syringe, Application: filling joints and micro-gaps between the processor and the base of the cooling system, Net weight: 30g, Thermal resistance: max. 0.0087°C/W, Anzahl je Verpackung: 1 Stücke.
Weitere Produktangebote 51653 nach Preis ab 11.13 EUR bis 12.51 EUR
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51653 | Hersteller : QOLTEC |
Category: Heat conductive compounds Description: Heat transfer paste; grey; 4.63W/mK; max.0.0087°C/W; 30g Type of chemical agent: heat transfer paste Colour: grey Agent features: easy aplication; perfect insulation; thermally conductive Thermal conductivity: 4.63W/mK Kind of package: syringe Application: filling joints and micro-gaps between the processor and the base of the cooling system Net weight: 30g Thermal resistance: max. 0.0087°C/W |
auf Bestellung 34 Stücke: Lieferzeit 14-21 Tag (e) |
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