Hersteller: TE Connectivity
Category: D-Sub plugs and sockets
Description: Connector: D-Sub

Hersteller: TE Connectivity / AMP
D-Sub Micro-D Connectors M83513/02-BC MCKS-C2-B-15SS

Hersteller: TE Connectivity Aerospace, Defense and Marine
Description: CONN MICRO-D RCPT 15POS SLDR CUP
Packaging: Bulk
Features: Reverse Layout
Connector Type: Receptacle, Female Sockets
Contact Finish: Gold
Mounting Type: Free Hanging (In-Line)
Number of Positions: 15
Number of Rows: 2
Contact Type: Signal
Flange Feature: Housing/Shell (Unthreaded)
Termination: Solder Cup
Connector Style: D-Type, Micro-D
Contact Finish Thickness: 50.0µin (1.27µm)
Shell Material, Finish: Metal, Yellow Chromate Plated Cadmium
Part Status: Active

Hersteller: Aavid
Thermal Interface Products In-Sil-8 Pad for TO220/218/247, Grey, 0.007"Thick, 0.75x0.50", 0.147"Hole Dia.

Hersteller: Aavid
Thermal Interface Products In-Sil-8 Pad for TO-3, Grey, 0.009 Inch Thickness, 1.593 x 1.1 Inch

Hersteller: TE Connectivity / Raychem
D-Sub Mil Spec Connectors M83513/02-BN

Hersteller: NXP Semiconductors
ARM Microcontrollers - MCU ARM 32B 32KFLASH, 48

Hersteller: Pulse Electronics
Description: CMC 6A 2LN SMD
Packaging: Tube
Package / Case: Horizontal, 4 PC Pad
Size / Dimension: 0.590" L x 0.715" W (14.99mm x 18.16mm)
Mounting Type: Surface Mount
Number of Lines: 2
Operating Temperature: -40°C ~ 130°C
Height (Max): 0.390" (9.91mm)
Current Rating (Max): 6A
DC Resistance (DCR) (Max): 9.4mOhm

Hersteller: NXP Semiconductors
32-bit Microcontrollers - MCU 32BIT 1M FLASH 80K RAM

Hersteller: NXP Semiconductors
32-bit Microcontrollers - MCU 32BIT 1M FLASH 80K RAM

Hersteller: SICK, Inc.
Description: LENS, 0.09X TELECENTIC
Packaging: Box

Hersteller: TE Connectivity
Category: D-Sub plugs and sockets
Description: Connector: D-Sub
Anzahl je Verpackung: 1 Stücke

Hersteller: TE Connectivity Aerospace, Defense and Marine
Description: CONN MICRO-D RCPT 15POS SLDR CUP
Packaging: Bulk
Features: Reverse Layout
Connector Type: Receptacle, Female Sockets
Contact Finish: Gold
Mounting Type: Free Hanging (In-Line)
Number of Positions: 15
Number of Rows: 2
Contact Type: Signal
Flange Feature: Housing/Shell (Unthreaded)
Termination: Solder Cup
Connector Style: D-Type, Micro-D
Contact Finish Thickness: 50.0µin (1.27µm)
Shell Material, Finish: Metal, Nickel Plated, Electroless
Part Status: Active

Hersteller: TE Connectivity
D-Sub Mil Spec Connectors M83513/02-BN

Hersteller: Aavid
Thermal Interface Products In-Sil-8 Pad for TO-3, Grey, 0.006 Inch Thickness, 1.593 x 1.1 Inch

Hersteller: Aavid
Thermal Interface Products In-Sil-8 Pad for TO-3, TO-220, TO-218, Grey, 0.006 Inch Thickness

Hersteller: Aavid
Thermal Interface Products In-Sil-8 Pad for TO220/218/247, Grey, 0.006"Thick, 0.687x0.562", 0.125"Hole Dia.

Hersteller: Aavid
Thermal Interface Products In-Sil-8 Pad for TO220/218/247, Grey, 0.006"Thick, 0.75x0.50", 0.147"Hole Dia.

Hersteller: Aavid
Thermal Interface Products In-Sil-8 Pad for TO-3, TO-220, TO-218, Rust, 0.009 Inch Thickness

Hersteller: Aavid
Thermal Interface Products In-Sil-8 Pad for TO-3, TO-220, TO-218, Rust, 0.009 Inch Thickness

Hersteller: Aavid
Thermal Interface Products In-Sil-8 Pad, TO220/218/247, 0.009"Thick, 0.75x0.41", Aavid #286, 0.156"Hole Dia

Hersteller: Aavid
Thermal Interface Products In-Sil-8 Pad, TO220/218/247, 0.009 Inch Thick, 0.16 Inch Hole Dia.

Hersteller: Aavid
Thermal Interface Products In-Sil-8 Pad for TO220/218/247, Grey, 0.007"Thick, 0.75x0.50", 0.125"Hole Dia.

Hersteller: Aavid
Thermal Interface Products In-Sil-8 Pad

Hersteller: Aavid
Thermal Interface Products In-Sil-8 Pad for TO220/218/247, Grey, 0.009"Thick, 0.75x0.50", 0.147"Hole Dia.

Hersteller: Aavid
Thermal Interface Products In-Sil-8 Pad for TO220/218/247, Grey, 0.009"Thick, 0.75x0.50", 0.125"Hole Dia.

Hersteller: Aavid
Thermal Interface Products In-Sil-8 Pad for TO220/218/247, Grey, 0.009"Thick, 0.75x0.41", 0.156"Hole Dia.

Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.333GHZ 780FCBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCBGA (23x23)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Active
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM

Hersteller: Infineon Technologies
Description: IC REG BUCK ADJ 6A 17PQFN
Packaging: Tape & Reel (TR)
Package / Case: 17-PowerVQFN
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 6A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 225kHz ~ 1.65MHz
Voltage - Input (Max): 16V
Topology: Buck
Supplier Device Package: 17-PQFN (5x6)
Synchronous Rectifier: Yes
Voltage - Output (Max): 14.4V
Voltage - Input (Min): 7V
Voltage - Output (Min/Fixed): 0.6V

Hersteller: TE Connectivity / Raychem
D-Sub Mil Spec Connectors MCKS-C2-B-15SS

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 15x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified

Hersteller: NXP Semiconductors
16-bit Microcontrollers - MCU 16-bit MCU, S12 core, 16KB Flash, 25MHz, -40/+150degC, Automotive Qualified, QFP 48

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified