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533201B02500G Boyd Laconia, LLC

Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf

Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 9.00°C/W
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 400 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 30°C
Attachment Method: Bolt On and PC Pin
Package Cooled: TO-218, TO-247
Width: 1.375" (34.93mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Material: Aluminum
Packaging: Bulk

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Technische Details 533201B02500G Boyd Laconia, LLC

Description: BOARD LEVEL HEAT SINK, Material Finish: Black Anodized, Fin Height: 0.500" (12.70mm), Thermal Resistance @ Natural: 9.00°C/W, Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 400 LFM, Power Dissipation @ Temperature Rise: 3.0W @ 30°C, Attachment Method: Bolt On and PC Pin, Package Cooled: TO-218, TO-247, Width: 1.375" (34.93mm), Type: Board Level, Vertical, Shape: Rectangular, Fins, Length: 2.000" (50.80mm), Material: Aluminum, Packaging: Bulk.