55755-201LF Amphenol Communications Solutions-FCI
Hersteller: Amphenol Communications Solutions-FCI240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free
auf Bestellung 395 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 129+ | 1.15 EUR |
| 131+ | 1.10 EUR |
| 133+ | 1.04 EUR |
| 135+ | 0.98 EUR |
| 250+ | 0.93 EUR |
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Produktbewertung abgeben
Technische Details 55755-201LF Amphenol Communications Solutions-FCI
Description: CONN ARRAY RCPT 240POS SMD GOLD, Packaging: Tape & Reel (TR), Connector Type: Array, Female Sockets, Contact Finish: Gold or Gold, GXT™, Mounting Type: Surface Mount, Number of Positions: 240, Pitch: 0.050" (1.27mm), Height Above Board: 0.211" (5.35mm), Contact Finish Thickness: 80.0µin (2.03µm), Mated Stacking Heights: 6mm, Part Status: Active, Number of Rows: 8.
Weitere Produktangebote 55755-201LF nach Preis ab 0.93 EUR bis 40.69 EUR
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55755-201LF | Hersteller : Amphenol ICC (FCI) |
Description: CONN ARRAY RCPT 240POS SMD GOLD Packaging: Cut Tape (CT) Connector Type: Array, Female Sockets Contact Finish: Gold or Gold, GXT™ Mounting Type: Surface Mount Number of Positions: 240 Pitch: 0.050" (1.27mm) Height Above Board: 0.211" (5.35mm) Contact Finish Thickness: 80.0µin (2.03µm) Mated Stacking Heights: 6mm Part Status: Active Number of Rows: 8 |
auf Bestellung 176 Stücke: Lieferzeit 10-14 Tag (e) |
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| 55755-201LF | Hersteller : Burndy |
Conn Board to Board RCP 240 POS 1.27mm Solder ST Top Entry SMD MEG-ARRAY® T/R |
auf Bestellung 395 Stücke: Lieferzeit 14-21 Tag (e) |
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55755-201LF | Hersteller : Amphenol Communications Solutions-FCI |
240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free |
Produkt ist nicht verfügbar |
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55755-201LF | Hersteller : FCI |
Conn Board to Board RCP 240 POS 1.27mm Solder ST Top Entry SMD MEG-ARRAY® T/R |
Produkt ist nicht verfügbar |
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55755-201LF | Hersteller : Amphenol ICC (FCI) |
Description: CONN ARRAY RCPT 240POS SMD GOLD Packaging: Tape & Reel (TR) Connector Type: Array, Female Sockets Contact Finish: Gold or Gold, GXT™ Mounting Type: Surface Mount Number of Positions: 240 Pitch: 0.050" (1.27mm) Height Above Board: 0.211" (5.35mm) Contact Finish Thickness: 80.0µin (2.03µm) Mated Stacking Heights: 6mm Part Status: Active Number of Rows: 8 |
Produkt ist nicht verfügbar |
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55755-201LF | Hersteller : Amphenol / InterCon Systems |
Board to Board & Mezzanine Connectors MEG ARRAY |
Produkt ist nicht verfügbar |