55755-201LF Amphenol ICC (FCI)
Hersteller: Amphenol ICC (FCI)Description: CONN ARRAY RCPT 240POS SMD GOLD
Packaging: Cut Tape (CT)
Connector Type: Array, Female Sockets
Contact Finish: Gold or Gold, GXT™
Mounting Type: Surface Mount
Number of Positions: 240
Pitch: 0.050" (1.27mm)
Height Above Board: 0.211" (5.35mm)
Contact Finish Thickness: 80.0µin (2.03µm)
Mated Stacking Heights: 6mm
Part Status: Active
Number of Rows: 8
auf Bestellung 176 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 60.11 EUR |
| 10+ | 52.65 EUR |
| 25+ | 50.37 EUR |
| 50+ | 48.75 EUR |
| 100+ | 47.12 EUR |
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Technische Details 55755-201LF Amphenol ICC (FCI)
Description: CONN ARRAY RCPT 240POS SMD GOLD, Packaging: Tape & Reel (TR), Connector Type: Array, Female Sockets, Contact Finish: Gold or Gold, GXT™, Mounting Type: Surface Mount, Number of Positions: 240, Pitch: 0.050" (1.27mm), Height Above Board: 0.211" (5.35mm), Contact Finish Thickness: 80.0µin (2.03µm), Mated Stacking Heights: 6mm, Part Status: Active, Number of Rows: 8.
Weitere Produktangebote 55755-201LF
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Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
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55755-201LF | Hersteller : FCI |
Conn Board to Board RCP 240 POS 1.27mm Solder ST Top Entry SMD MEG-ARRAY® T/R |
Produkt ist nicht verfügbar |
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55755-201LF | Hersteller : Amphenol ICC (FCI) |
Description: CONN ARRAY RCPT 240POS SMD GOLD Packaging: Tape & Reel (TR) Connector Type: Array, Female Sockets Contact Finish: Gold or Gold, GXT™ Mounting Type: Surface Mount Number of Positions: 240 Pitch: 0.050" (1.27mm) Height Above Board: 0.211" (5.35mm) Contact Finish Thickness: 80.0µin (2.03µm) Mated Stacking Heights: 6mm Part Status: Active Number of Rows: 8 |
Produkt ist nicht verfügbar |
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55755-201LF | Hersteller : Amphenol / InterCon Systems |
Board to Board & Mezzanine Connectors MEG ARRAY |
Produkt ist nicht verfügbar |